Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Structure and method for packaging organic electroluminescence component

An electroluminescent device, packaging structure technology, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problem of desorption and release of water vapor and oxygen, penetration of device sealing materials, and internal materials of devices containing water vapor and oxygen and other problems to achieve the effect of reducing adsorption and dissolution, improving performance and life, and reducing outgassing

Inactive Publication Date: 2010-02-24
UNIV OF ELECTRONICS SCI & TECH OF CHINA
View PDF0 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0021] The problem to be solved by the present invention is: how to provide a packaging structure and packaging method for organic electroluminescent devices, which can overcome the defects in the prior art, and not only solve the problem of water vapor and oxygen on the device The penetration problem of the sealing material also solves the problem that the gas inside the device contains water vapor and oxygen, and the materials inside the device continuously desorb and release water vapor and oxygen.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Structure and method for packaging organic electroluminescence component
  • Structure and method for packaging organic electroluminescence component
  • Structure and method for packaging organic electroluminescence component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] Example 1 Vacuum-encapsulated organic electroluminescent device with glass substrate and cover plate

[0067] The packaging structure of this device is as figure 2 shown.

[0068] Manufacturing process of glass substrate 1:

[0069] Step 1, plating an ITO thin film electrode layer 3 on the upper surface of the substrate glass 1, the plating method is DC magnetron sputtering or radio frequency magnetron sputtering.

[0070] In step 2, an insulating film 8 is plated on the surface of the ITO thin film electrode layer 3 corresponding to the sealing position to cover the surface of the ITO thin film electrode layer 3 at the sealing position. The coating method is one of vacuum evaporation coating, electron beam evaporation coating and reactive sputtering coating. The film thickness of the insulating layer is 50-200nm.

[0071] Step 3, at the position to be sealed at the frame of the glass substrate 1, on the surface of the glass part including the part with the insulat...

Embodiment 2

[0087] Example 2 A vacuum-encapsulated organic electroluminescence device in which the substrate is glass and the cover plate is metal

[0088] Manufacturing process of glass substrate 1:

[0089] Same as 1 embodiment 1 process.

[0090] The manufacturing process of the metal cover plate 15:

[0091] Step 1: At the sealing position of the metal cover plate 15, the transition layer thin films 11 and 12 are plated by methods such as DC magnetron sputtering, ion plating and vacuum evaporation. The materials of the transition layer are metals such as Au, Ag, Pt and Cu. The thickness of the transition layer is 50-200nm.

[0092] Step 2: On the center of the inner surface of the metal cover plate 15 and on the metal surface in the vicinity, vacuum evaporation, electron beam evaporation and other methods are used to plate an evaporative getter layer.

[0093] Device sealing process:

[0094] Same as embodiment 1 process.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
melting pointaaaaaaaaaa
Login to View More

Abstract

The invention discloses a structure and a method for packaging an organic electroluminescence component (OLED / PLED). The structure mainly comprises a sealing material of a sealing connection part between the side frame of a basal plate and the side frame of a cover plate of the component, and the sealing material is indium alloy with low melting point. The internal surface of the cover plate is provided with a getter layer, and the sealing connection process of the component is carried out in a high-vacuum environment. The sealing material of the component has an ideal obstruction performanceto vapour and oxygen. After the component is sealed and connected, high vacuum is kept in the internal space of the component. A getter in the component can continuously adsorb gas which is desorbed and released by the internal material of the component, the high vacuum can be maintained in the component for a long time, the damage of the vapour and the oxygen to an organic light-emitting functional layer material in the component is farthest avoided, and the component can reach long service life meeting the requirement of commercial application.

Description

technical field [0001] The invention relates to the technical field of organic electroluminescent devices, in particular to a packaging structure and a packaging method of organic electroluminescent devices. Background technique [0002] Small molecule organic electroluminescent devices (OLEDs) and polymer organic electroluminescent devices (PLEDs) have active luminescence, high brightness, full-color display, low driving voltage, thin device thickness, flexible display, and the preparation process is relatively Liquid crystal display (LCD) and plasma display (PDP) are simple and have good application prospects in large-screen flat panel displays and flexible displays. [0003] The organic light-emitting materials in OLED / PLED are very sensitive to water vapor and oxygen, and a small amount of water vapor and oxygen can damage the organic light-emitting materials and degrade the light-emitting performance of the device. Therefore, how to reduce the penetration of water vapo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/50H01L51/52H01L51/54H01L51/56
Inventor 李军建
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com