A method for quantifying defects in a transparent substrate

A defect, transparent technology, applied in the field of defect systems, able to solve problems such as difficulty, inability to achieve satisfactory precision and accuracy, repeatable and reliable visual inspection of wire bundle and streak defects, etc.

Inactive Publication Date: 2010-03-03
CORNING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] Repeatable and reliable visual inspection of harness and streak defects has proven extremely difficult, especially using manual methods, and cannot achieve the precision and accuracy necessary to meet current industry standards

Method used

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Embodiment Construction

[0013] The following description of the invention is presented to illustrate the invention to the best extent, and is generally referred to as the embodiment. For this reason, those of ordinary skill in the relevant art will recognize and appreciate that many changes can be made to the various embodiments of the invention described herein and still obtain the beneficial results of the invention. It will also be readily apparent that the desired benefits of the invention may be obtained by selecting certain features of the invention without employing others. Accordingly, those of ordinary skill in the art will recognize that, under certain circumstances, many modifications and alterations to the present invention may be required, and even must be made, and which form a part of the present invention. Accordingly, the following description is provided by way of illustration of the principles of the invention and not by way of limitation.

[0014] As used herein, the terms "a," "...

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Abstract

Disclosed is a method for the detection and quantification of defects in transparent substrates and, more particularly, in glass sheets. The method comprises providing a transparent planar substrate having a top surface and a bottom surface. The surface topography of at least a portion of the top surface of the provide transparent planar substrate is measured to obtain a three dimensional top surface profile having a sub-nanometer level of precision. From the three dimensional surface profile measurement, the existence of one or more surface variations in the three dimensional surface profilehaving an amplitude greater than a predetermined tolerance can be identified and / or quantified.

Description

technical field [0001] The present invention relates to systems, methods and apparatus for detecting and quantifying defects in transparent substrates, especially glass sheets. Background technique [0002] Recently, a lot of attention has been focused on the detection of mura defects in transparent substrates such as glass plates, mainly because of the popularity and acceptance of liquid crystal display (LCD) televisions in the world market. Likewise, the industry faces the challenge of meeting the increasing demand for substrates while complying with stringent LCD mode specifications. Typically, defects such as streaks, cords, and surface discontinuities are detected using human inspectors and manual methods. However, with these existing detection techniques, the necessary precision and accuracy required by current application specifications cannot be achieved. [0003] For example, striations and stranding features in LCD glass are physical anomalies that can be observe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/00
CPCG01B11/2441G01N21/958G01N2021/9513G01B11/24G01B11/30G01N21/88
Inventor K·M·希尔R·L·麦克卢尔R·S·普里斯特雷
Owner CORNING INC
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