RFID label and method for manufacturing same
A technology of RFID tags and reinforcements, applied in the direction of semiconductor/solid-state device parts, instruments, semiconductor devices, etc., can solve problems such as bending, and achieve the effects of easy manufacturing, inhibiting wire breakage, and avoiding stress concentration
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[0071] Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0072] figure 2 and image 3 These are a cross-sectional view and a plan view showing an RFID tag according to the first embodiment of the electronic device of the present invention, respectively. and, in figure 2 In the cross-sectional view, in order to understand the structure easily, and image 3 The top view shows the central portion of the RFID tag enlarged in comparison.
[0073] Should figure 2 as well as image 3 RFID tag 10 shown with figure 1 Compared with the shown RFID tag 90, except that the structure of the package body and the reinforcing body is different, other figure 1 The RFID tag 90 shown is the same. That is, the antenna 12 is formed on the flexible substrate 11 and the circuit chip 13 is mounted, and the circuit chip 13 is fixed with an adhesive 14 . Furthermore, a potting material 15 covering the upper part of the circuit chip 13 and a...
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