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RFID label and method for manufacturing same

A technology of RFID tags and reinforcements, applied in the direction of semiconductor/solid-state device parts, instruments, semiconductor devices, etc., can solve problems such as bending, and achieve the effects of easy manufacturing, inhibiting wire breakage, and avoiding stress concentration

Inactive Publication Date: 2011-06-29
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When the RFID tag 90 is used, for example, it is worn on soft materials such as clothes, so it may be bent during washing

Method used

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  • RFID label and method for manufacturing same
  • RFID label and method for manufacturing same
  • RFID label and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0071] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0072] figure 2 and image 3 These are a cross-sectional view and a plan view showing an RFID tag according to the first embodiment of the electronic device of the present invention, respectively. and, in figure 2 In the cross-sectional view, in order to understand the structure easily, and image 3 The top view shows the central portion of the RFID tag enlarged in comparison.

[0073] Should figure 2 as well as image 3 RFID tag 10 shown with figure 1 Compared with the shown RFID tag 90, except that the structure of the package body and the reinforcing body is different, other figure 1 The RFID tag 90 shown is the same. That is, the antenna 12 is formed on the flexible substrate 11 and the circuit chip 13 is mounted, and the circuit chip 13 is fixed with an adhesive 14 . Furthermore, a potting material 15 covering the upper part of the circuit chip 13 and a...

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PUM

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Abstract

An electronic device in which bending stress to a circuit chip is reduced and disconnection of a conductor pattern is avoided. The electronic device comprises a base (11), a conductor pattern (12) wired on the base, a circuit chip (13) connected electrically with the conductor pattern (12), a reinforcing body (16) provided, as an internal structure, with a plurality of concentric rings (16a, 16b)having annular external form arranged on the base (11) to surround the circuit chip (13), and a body (15a) sealing the circuit chip (13) on the base (11) to cover the upper part of the circuit chip (13) while burying the inside of the reinforcing body (16).

Description

technical field [0001] The present invention relates to an electronic device, an electronic device on which the electronic device is mounted, an article on which the electronic device is mounted, and a method for manufacturing the electronic device. Background technique [0002] Conventionally, electronic devices in which circuit chips are mounted on a base such as a printed wiring board are widely known. Such an electronic device is used for applications such as being built into an electronic device to control the electronic device, or exchanging information with an external device as a single unit. As an example of an electronic device, external devices represented by a reader / writer and various RFID (Radio Frequency IDentification: radio frequency identification) tags that exchange information in a non-contact manner using radio waves are well known. As a kind of this RFID label, the label that has following structure has been proposed, promptly on the substrate that is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/28G06K19/07G06K19/077
CPCH01L23/3135H01L2224/73204H01L2224/32225G06K19/07728H01L2224/16225H01L23/16H01L23/24H01L2924/00G06K19/07G06K19/077H01L23/28
Inventor 小林弘小八重健二竹内周一吉良秀彦
Owner FUJITSU LTD