Microfluid conveying and atomizing device
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- MICROJET TECH
- Publication Date
- 2010-03-10
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Abstract
Description
Technical field
[0001] The invention relates to a microfluid delivery and atomization device, especially a microfluid delivery and atomization device suitable for heat dissipation of electronic components. Background technique
[0002] In recent years, computer systems have gradually become an indispensable device in people’s daily lives. There is a motherboard inside to maintain the operation of the entire computer system. However, the heating elements on the motherboard, such as the CPU, will generate A large amount of heat. If the heat cannot be transferred to the outside and accumulated in the housing, it will not only reduce the life of the heating element or even damage it, but also reduce the operating performance of the entire computer system. Therefore, in order to maintain the life of the computer system and For efficiency, an appropriate heat dissipation mechanism is usually adopted on the motherboard to transfer heat to the outside world.
[0003] The current heat diss...