Microfluid conveying and atomizing device

An atomization device and microfluidic technology, applied in the direction of electric solid devices, semiconductor devices, semiconductor/solid device components, etc., can solve problems such as inability to meet thin requirements, complex structure, and large volume of suction pumps
CN101668404AActive Publication Date: 2010-03-10MICROJET TECH

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
MICROJET TECH
Publication Date
2010-03-10

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Abstract

The invention relates to a microfluid conveying and atomizing device used for conveying fluid, atomizing the fluid into a plurality of liquid drops and jetting the liquid drops. The device comprises amicrofluid conveyor and an atomizer, wherein the microfluid conveyor is provided with an entryway; the atomizer is provided with a nozzle piece, a storage groove and an actuating element, and the nozzle piece is arranged corresponding to the storage groove and is connected with the actuating element; and the microfluid conveyor is achieved as follows: fluid is conveyed the storage groove of the atomizer through the entryway to enable the nozzle piece to atomize the fluid into a plurality of the liquid drops to be jetted corresponding to the drive of the actuating element .
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Description

Technical field

[0001] The invention relates to a microfluid delivery and atomization device, especially a microfluid delivery and atomization device suitable for heat dissipation of electronic components. Background technique

[0002] In recent years, computer systems have gradually become an indispensable device in people’s daily lives. There is a motherboard inside to maintain the operation of the entire computer system. However, the heating elements on the motherboard, such as the CPU, will generate A large amount of heat. If the heat cannot be transferred to the outside and accumulated in the housing, it will not only reduce the life of the heating element or even damage it, but also reduce the operating performance of the entire computer system. Therefore, in order to maintain the life of the computer system and For efficiency, an appropriate heat dissipation mechanism is usually adopted on the motherboard to transfer heat to the outside world.

[0003] The current heat diss...

Claims

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