Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for transferring thin film to substrate

A technology for substrates and films, which is applied in the field of transferring single-layer films from temporary surfaces to touch-sensitive surfaces, which can solve the problems of high cost, difficulty in driving lines and sensing lines, etc.

Inactive Publication Date: 2010-03-24
APPLE INC
View PDF2 Cites 33 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the increasing need for smaller, thinner, flexible and non-flat touch sensor panels, it can be difficult and expensive to fabricate drive and sense lines directly on the substrates required by such panels

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for transferring thin film to substrate
  • Method for transferring thin film to substrate
  • Method for transferring thin film to substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] In the following description of the preferred embodiments, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration specific embodiments in which the invention may be practiced. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the preferred embodiments of the present invention.

[0030] The present invention relates to the transfer of single-layer thin films of conductive materials to substrates used in devices such as touch sensor panels. In some embodiments, transfer can be accomplished by patterning a single layer of conductive material on one side of a transfer substrate and then transferring the patterned material from the transfer substrate to a target substrate. Such an approach advantageously allows the transfer of the patterned material to any target substrate, which may be one that cannot withstand standard manufact...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for transferring single layer thin film from a temporary substrate to a target substrate is disclosed. A base layer may be fabricated onto a fabrication sheet. A single layer thin film of conductive material may be patterned onto the base layer. A temporary transfer substrate may be adhered to the single layer thin film. The fabrication sheet may be removed and the base layer-patterned single layer thin film-temporary transfer substrate block transferred to a target substrate, where the base layer may contact the target substrate. Upon completion of the transfer, the temporary transfer substrate may be removed.

Description

technical field [0001] The present invention relates generally to the transfer of thin films to target substrates, and more particularly to the transfer of single-layer thin films of conductive materials from temporary surfaces to touch-sensitive surfaces. Background technique [0002] There are many types of input devices currently available for performing operations in computing systems, such as buttons or keys, mice, trackballs, touch sensor panels, joysticks, touch screens, and the like. In particular, touch screens are becoming increasingly popular due to their ease of operation and versatility, as well as their falling prices. A touch screen may include: a touch sensor panel, which may be a transparent panel with a touch-sensitive surface; and a display device, such as an LCD panel, which may be located partially or completely behind the touch-sensor panel such that the touch-sensitive surface At least a portion of the viewable area of ​​the display device may be cove...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041
CPCB32B27/00B32B37/025B32B2457/208B32B17/06
Inventor 常世长黄丽丽S·P·霍特林
Owner APPLE INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com