Fpd substrate and semiconductor wafer inspection system using duplicate images
An inspection system, repeating image technology, used in semiconductor/solid state device testing/measurement, measurement devices, material analysis by optical means, etc., to reduce costs
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[0044] In order to accomplish the above-mentioned problems, an FPD substrate and semiconductor wafer inspection system using repeated images according to an embodiment of the present invention analyzes the images captured by the camera, and the inspection system includes:
[0045] The camera is installed on the upper side of the flat display panel or the semiconductor wafer, and captures the reflected light generated by the light supplied from the first lighting unit being reflected by the flat panel display panel or the semiconductor wafer, or captures the light supplied from the second lighting unit Photographing the reflected light generated by the reflection of particles existing in the flat panel display panel or semiconductor wafer;
[0046] The first lighting unit, which is arranged in a direction corresponding to the camera above, is used to supply the camera with the amount of light required for shooting:
[0047]The second lighting unit, which is arranged in a direct...
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