Decompression drying device and method

Abstract

The invention provides a decompression drying device and method. The decompression drying device performs drying treatment on the treating liquid on a substrate to be treated which is coated with treating liquid to form a coating film, therefore the drying time of the treating liquid can be shortened, and uniform film thickness can be obtained. The decompression drying device comprises chambers (85,86) for receiving the substrate to be treated (G) for forming a treating space; a holding part (88) arranged in the chamber (85,86) for holding the substrate to be treated (G); an air exhaust (89) formed in the chamber (85,86); an exhaust component (91) for exhausting indoor air from the air exhaust (89); rectifying components (93,94,95) arranged in the chambers for forming a flowpath flowing toa direction on an upper surface of the substrate through the exhaust action of the exhaust component (91).

Description

technical field [0001] The present invention relates to a reduced-pressure drying device and a reduced-pressure drying method for drying a substrate to be processed coated with a processing liquid in a reduced-pressure environment in order to form a coating film in a photolithography process. Background technique [0002] For example, in the manufacturing process of FPDs (Flat Panel Displays), circuit patterns are formed by a so-called photolithography process. agent (hereinafter referred to as resist) to form a resist film, the resist film is exposed to light corresponding to the circuit pattern, and a development treatment is performed on the resist film. [0003] In the step of forming the above-mentioned resist film, after the resist is applied to the substrate, a reduced-pressure drying treatment for drying the applied film by reducing the pressure is performed. [0004] Conventionally, as an apparatus for performing such reduced-pressure drying treatment, there are, f...

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Problems solved by technology

[0010] However, in recent years, the size of glass substrates used in FPDs and the like has increased, and the chamber for accommodating glass substrates in reduced-pressure drying processing units has also increased in size.

[0011] Therefore, the volume in the chamber increases, and it takes time to depressurize to the specified pressure

In addition, since the amount of resist applied to the substrate increases, it takes time until the resist dries uniformly over the entire substrate, resulting in a decrease in production efficiency.

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