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Front open type wafer box with latch and airtight structure

A front-opening wafer box, air-tight structure technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem that the box body 10 cannot be stuck, the box body 10 and the door body 20 cannot be closed, and Issues such as increasing the manufacturing cost of front-opening wafer cassettes

Active Publication Date: 2010-03-31
GUDENG PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method similar to lateral traction tends to generate an offset force in the moving direction of the movable pin 231, which will cause it to fail to be inserted into the socket of the box body 10, so that the box body 10 and the door body 20 cannot be connected. cover
At the same time, it will also increase the manufacturing cost of the front open wafer box

Method used

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  • Front open type wafer box with latch and airtight structure
  • Front open type wafer box with latch and airtight structure
  • Front open type wafer box with latch and airtight structure

Examples

Experimental program
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Embodiment Construction

[0043] Please refer to Figure 5 , is a top view of a latch structure 60 of a door body 20 of the FOUP according to the present invention. Such as Figure 5 As shown, a pair of latch structures 60 are included between the outer surface and the inner surface of the door body 20, wherein each latch structure 60 is composed of an elliptical cam 62, a pair of sliding devices 64 in contact with the two ends of the elliptical cam 62, at least one The pulley 66 is disposed between the outer surface and the inner surface of the door body 20 and is embedded in the slide groove 642 of the sliding device 64 and at least one positioning elastic piece 68 integrally connected with the sliding device 64 . Next, please refer to Image 6 ,yes Figure 5 The enlarged schematic diagram of the contact end of the elliptical cam 62 and the sliding device 64 in FIG. Such as Image 6 As shown, in a preferred embodiment of the present invention, a positioning pulley 644 can be configured at the co...

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PUM

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Abstract

The invention relates to a front open type wafer box with a latch and an airtight structure, mainly comprising a box body and a door body, wherein the box body is internally provided with a pluralityof slots for placing a plurality of wafers; an opening is formed on one side of the box body and used for the input and output of the plurality of the wafers; the door body is provided with an external surface and an internal surface; and the internal surface of the door body is combined with the opening of the box body to protect the plurality of the wafers placed in the box body. The front opentype wafer box is characterized in that the door body is internally provided with at least a latch structure, and the periphery of the internal surface of the door body is provided with an inflatableairtight piece.

Description

technical field [0001] The present invention relates to a front-opening wafer box, in particular to a front-opening wafer box with a latch inside the door body and an inflatable airtight member on the inner surface of the door. Background technique [0002] Semiconductor wafers will be transported to different workstations due to the need to go through various processes and to cooperate with process equipment. In order to facilitate the handling of wafers and avoid contamination from the outside, a sealed container is often used for transportation by automated equipment. Please refer to figure 1 Shown is a schematic diagram of a known wafer box. This wafer pod is a front opening type wafer pod (Front Opening Unified Pod, FOUP), which has a box body 10 and a door body 20, inside the box body 10 is provided with a plurality of slots 11 which can accommodate multiple a wafer, and on one side of the box body 10, there is an opening 12 for loading and unloading of the wafer; ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673
Inventor 邱铭隆洪国钧
Owner GUDENG PRECISION IND CO LTD
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