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Circuit board

A technology of circuit board and circuit layer, which is applied in the direction of electrical connection formation of printed components, can solve the problem of increasing the difficulty of wiring design in the power supply layer, and achieve the effect of increasing the usable area, facilitating wiring design, and reducing the area

Inactive Publication Date: 2011-06-22
湖南格致测控技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the number of wires increases, the number of through holes also increases, which reduces the available area of ​​the power layer and increases the difficulty of wiring design.

Method used

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Embodiment Construction

[0021] figure 1 Shown is a partial cross-sectional view of a circuit board according to an embodiment of the present invention. Please refer to figure 1 The circuit board 100 of this embodiment includes a plurality of circuit layers 102 (two are taken as an example here), a power layer 104 , a plurality of insulating layers 106 and a conductive pattern 108 . The power layer 104 is disposed between the two circuit layers 102 , and each insulating layer 106 is located between the adjacent power layer 104 and the circuit layer 102 . The circuit board 100 has at least one through hole 110 , but the number of the through holes 110 can also be increased as required. The through hole 110 penetrates through the insulating layer 106 , the circuit layer 102 and the power layer 104 . The aperture diameter of each portion of the through hole 110 increases as the distance between the portion and the power layer 104 increases. In this embodiment, the aperture D2 of the portion of the th...

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Abstract

The invention discloses a circuit board for reducing the area occupied by through holes during passing through a power supply layer. The circuit board comprises a plurality of circuit layers, one power supply layer, a plurality of insulating layers and one conducting pattern. The power supply layer is arranged among the circuit layers, and each insulating layer is arranged between the adjacent circuit layers or adjacent power supply layers and the circuit layers. The circuit board is provided with at least one through hole passing through the insulating layers, the circuit layers and the power supply layer, and the apertures on all parts of the through hole are increased following the increase of the distance between the through hole and the power supply layer. The conducting pattern is arranged on the wall of the through hole and connected with at least two of the circuit layers.

Description

technical field [0001] The present invention relates to a circuit board, and in particular to a circuit board with through holes. Background technique [0002] With the development of science and technology, the functions of electronic products are constantly added, which makes more and more wires on the circuit board. The through holes on the circuit board are needed to connect the lines on each circuit layer. These through holes pass through the power layer of the circuit board and occupy the area that can be used to lay the power layer. As the number of wires increases, the number of through holes also increases, which reduces the available area of ​​the power layer and increases the difficulty of wiring design. Contents of the invention [0003] The invention provides a circuit board, which is used to reduce the area occupied by through holes passing through the power supply layer. [0004] The invention provides a circuit board, which is characterized by comprising ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42
Inventor 柳妍杨淑敏
Owner 湖南格致测控技术有限公司
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