Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for preparing low-temperature cured conductive paste

A conductive paste, low temperature technology, used in conductive materials, conductive materials, cable/conductor manufacturing, etc., can solve the problems of high price and high cost in the electronic market, and achieve the effect of reducing production costs

Inactive Publication Date: 2011-06-15
IRICO
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Among the currently applicable conductive paste products, the content of silver powder in the paste is 50.0-70.0%. Silver is a kind of precious metal, and its cost is 3-4 times that of conventional base metals, and most of the market purchases foreign brands Expensive, which leads to the high cost of the entire electronic market

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0018] The invention discloses a preparation method of sheet low-temperature curing conductive paste, which comprises the following steps:

[0019] Step 1): Preparation of organic vehicle

[0020] Dissolve one or more of 10.0% to 30.0% of vinyl resin or polyester resin or PVC resin or amino resin in 70% to 90% of ethylene glycol ether or terpineol or cyclohexyl by mass percentage One or several solvents in the ketone, and then heated at a constant temperature of 70-90°C until completely dissolved, and filtered to obtain an organic carrier;

[0021] Step 2): Prepare a mixed solution of two conductive phases of nickel powder and silver powder

[0022] Adding 60% to 80% of superfine nickel powder (60 to 200nm in particle size) by mass percentage into 20.0% to 40.0% of the above-mentioned organic carrier, and stirring evenly to prepare a superfine nickel powder mixed solution;

[0023] Add 5% to 30.0% of spherical silver powder (with a particle size of 0.4 to 1.2um) and 50.0% to...

Embodiment 1

[0030] Firstly, under constant temperature condition of 70° C., 5 grams of vinyl acetate resin was dissolved in 40 grams of ethylene glycol ether and 5 grams of terpineol, and the organic carrier was obtained by filtration.

[0031] Then add 24 grams of nickel powder (60-100nm) to 16 grams of the above-mentioned organic vehicle; 5 grams of spherical silver powder (0.4-1.0um) and 30 grams of flake silver powder (1.4-5.0um) are added to 15 grams of the above-mentioned organic vehicle 0.1 g of polyethylene wax dispersant was added respectively, and mixed uniformly to obtain a mixed solution of the above two conductive phases.

[0032] Finally, the nickel powder mixed solution of 5 grams and the silver powder mixed solution of 35 grams are combined and mixed, and 1.5 grams of γ-aminopropyltriethoxysilane thickener and 0.1 gram of polyethylene wax dispersant are added in the combined mixed solution , mixed evenly in a planetary mixer, after passing through a three-roll mill, adding...

Embodiment 2

[0034] First, 10 grams of vinyl acetate resin and 5 grams of polyester resin were dissolved in 20 grams of ethylene glycol ether and 15 grams of terpineol at a constant temperature of 75° C., and filtered to obtain an organic carrier.

[0035] Then add 32 grams of nickel powder (60-150nm) to 8 grams of the above-mentioned organic vehicle; 15 grams of spherical silver powder (0.6-1.2um) and 25 grams of flake silver powder (2.4-9.0um) are added to 10 grams of the above-mentioned organic vehicle 0.4 g of microcrystalline paraffin dispersant was added respectively, and mixed uniformly to obtain a mixed solution of the above two conductive phases.

[0036] Finally, 25 grams of nickel powder mixed solution and 20 grams of silver powder mixed solution are combined and mixed, and 1.0 gram of vinyl tris (beta-methoxyethoxy) silane thickener and 0.4 gram of micro Crystal paraffin wax dispersant, mixed evenly in a planetary mixer, after passing through a three-roll mill, adding 3.6 grams...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for preparing low-cost low-temperature cured conductive paste for screen printing. In the preparation method, base metal nickel (Ni) is used to replace part of used precious metal silver (Ag); nickel powder and silver powder form a conductive function phase of the conductive paste together, wherein the change of the adding proportion of the nickel powder not only can adjust the final electrical property, but also can adjust the printing performance of the paste well; the change of the adding proportion of an organic carrier can adjust the viscosity and the electric conductivity of a product; and the change of the adding proportion of a thickening agent can adjust the viscosity, the leveling property and the printing performance of the product. The quick drying and curing can be performed at a constant temperature of between 120 and 150 DEG C to form the product with good electrical property. The conductive paste of the invention adopts the base metal to replace partial precious metal silver, so the production cost is greatly reduced, and the performance reaches the level of high silver content.

Description

Technical field: [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a method for preparing a low-temperature curing conductive paste for a membrane switch. Background technique: [0002] As ergonomics and aesthetic design become more important in electronic products, Chinese membrane switch manufacturers are working on developing brighter and richer products to meet the growing demand. Membrane switches are gradually replacing electromechanical switches in low-power consumer electronics, home appliances, and industrial applications due to the variety of designs and the ability to overprint various exquisite patterns to help users quickly and easily identify their functions. In addition, membrane switches are also popular in applications such as toys, mobile phones, PDAs, calculators, remote controls, computer keyboards, and medical equipment due to their good tactile appearance, anti-reflection, and functional annotation...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01B13/00H01B1/00H01B1/02
Inventor 陈春锦
Owner IRICO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com