Configurable on-chip testing module supporting encapsulation of different pins of chip

Abstract

The invention discloses a configurable on-chip testing module supporting the encapsulation of a chip through different pins, which consists of an encapsulation form controller (101), a pin converter (102), a pin signal controller (103) and a bus signal selector (104). The testing module can support the encapsulation form of the multifunctional chip that the different pins are adopted for different pieces of application. The configurable on-chip testing module supporting the encapsulation of the chip through the different pins is characterized in that: 1, the testing module is strong in universality and wide in testing range and can almost test all other functional modules except an internal CPU; 2, the testing module is less logical and can ignore influence on the area of the chip, thus the production cost of the chip is not increased; and 3, a virtual CPU (an excitation controller) adopted in testing is arranged outside the chip, thus the development on testing programs is more flexible and more relevant.

Description

technical field [0001] The invention relates to embedded chip technology, in particular to a test module in the embedded chip. The test module can be configured to support a multi-function chip with different pins (pins) for different applications. Background technique [0002] The current SOC (System on Chip, called system-on-chip or system-on-chip) technology is developing rapidly, and the product life cycle is shortened. It is often not economical to develop a chip for a certain application. More and more IC designers are more inclined to integrate more various functional modules on one chip, and then through subsequent market research and software development, the same chip can be used in different fields, thereby prolonging product survival cycle to maximize profits. The result of doing so will inevitably increase the number of pins in the chip design, but when such a chip design is applied to a specific field, it does not need so many pins, so when the same chip desi...

AI Technical Summary

Problems solved by technology

[0004] The invention provides a configurable on-chip test module that supports different pin packages of the chip, and aims to solve the test compatibility problem caused by a multi-functional chip adopting different pin packages for different applications

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