Configurable on-chip testing module supporting encapsulation of different pins of chip
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 苏州国芯科技股份有限公司
- Publication Date
- 2010-05-12
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Abstract
Description
technical field
[0001] The invention relates to embedded chip technology, in particular to a test module in the embedded chip. The test module can be configured to support a multi-function chip with different pins (pins) for different applications. Background technique
[0002] The current SOC (System on Chip, called system-on-chip or system-on-chip) technology is developing rapidly, and the product life cycle is shortened. It is often not economical to develop a chip for a certain application. More and more IC designers are more inclined to integrate more various functional modules on one chip, and then through subsequent market research and software development, the same chip can be used in different fields, thereby prolonging product survival cycle to maximize profits. The result of doing so will inevitably increase the number of pins in the chip design, but when such a chip design is applied to a specific field, it does not need so many pins, so when the same chip desi...