Laser processing machine

Abstract

The invention provides a laser processing machine that can easily adjust the width of an image of a laser beam focused on a workpiece, i.e., the width of a processing line, without the necessity of replacement of a mask, and consequently to streamline work and to suppress a cost rise. A flat plate-like mask is disposed between a mirror and a relay lens in an optical system so as to be perpendicular to the optical path of a laser beam. The mask is horizontally shiftable. The laser beam is allowed to pass through an elongate trapezoidal aperture formed in the mask to extend in the shifting direction. The sectional shape of a portion of the laser beam passing through the aperture of the wafer is focused on the wafer. Shifting the mask can adjust the width of an image of the laser beam focused on the wafer.

Description

technical field [0001] The present invention relates to a laser processing device for forming grooves, slits, etc., by irradiating laser beams to workpieces such as semiconductor wafers, for example. Background technique [0002] In the chip manufacturing process of semiconductor devices, a plurality of rectangular chip areas are divided on the surface of a roughly disc-shaped semiconductor wafer by dividing lines arranged in a grid pattern. When ICs and LSIs are formed on these chip areas After waiting for the electronic circuit, the wafer is subjected to necessary processing such as back grinding, and then the wafer is cut along the planned dividing line to be divided, that is, diced, and each chip region is obtained as a semiconductor chip. The semiconductor chip obtained as above is packaged by resin sealing, and is widely used in various electric / electronic devices such as mobile phones and PCs (Personal Computers). [0003] As a dicing method for dividing a wafer into...

AI Technical Summary

Problems solved by technology

However, in this way, it is necessary to prepare a plurality of masks with different opening widths, and to select and replace the masks according to the width of the processing line, which may cause disadvantages such as complexity and cost increase.

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