Unlock instant, AI-driven research and patent intelligence for your innovation.

Dynamic squelch detection power control

A technology for dynamic detection and detection of power, applied in advanced technologies, instruments, sustainable buildings, etc., and can solve problems such as power consumption

Inactive Publication Date: 2012-09-05
INTEL CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since squelch logic is usually provided for each lane of the interconnect, such squelch logic consumes a lot of power

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dynamic squelch detection power control
  • Dynamic squelch detection power control
  • Dynamic squelch detection power control

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] In various embodiments, the interconnect's squelch logic can be selectively enabled to reduce power consumption. More specifically, in various embodiments, a semiconductor device such as a processor including an integrated memory controller and I / O controller may have an internal (ie, on-chip) interconnection. The interconnect circuitry may include squelch control logic for selectively enabling or disabling squelch circuits associated with one or more channels of a given interconnect. In various embodiments, as will be described below, the squelch control can be dynamic and can be controlled via hardware and software to provide improved squelch reliability while reducing power consumption.

[0021] Various embodiments may improve idle power of chipset or multi-core processor (MCP) components by selectively enabling squelch detection circuits in the physical layer of the interconnect. Additionally, full dynamic isolation of the physical and link layers is provided to h...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

In one embodiment, the present invention includes power control logic for squelch detection circuitry to enable selective enabling of one or more squelch detection circuits of an interconnect interface in a low power mode. The logic may include a squelch mode control register to select a first mode or a second mode of power control, a second register coupled to the squelch mode control register to receive software settings to indicate which squelch detect circuit(s) to disable in a low power state of the interconnect, and a detector to dynamically detect a logical lane zero of the interconnect in the second mode. Other embodiments are described and claimed.

Description

technical field [0001] The present invention relates to dynamic squelch detection power control. Background technique [0002] Modern computer systems are often formed of many semiconductor components that can communicate together via various interconnects such as those found on circuit boards. A common such interconnection mechanism used, for example, for incorporation into peripheral devices such as graphics cards is based on the PCIExpress TM Specification Base Specification Version 2.0 (released on January 17, 2007) (hereinafter referred to as PCIe TM specification) of the link Peripheral Component Interconnect Express (PCIe TM )protocol. Such interconnects can be formed from multiple layers including transaction layer, link layer and physical layer. [0003] To reduce power consumption when no communication occurs on a given interconnect, various mechanisms may be provided. If communication is not likely to occur for a period of time, the interconnect may be placed...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F1/32
CPCG06F1/3287Y02B60/1278G06F1/3209Y02B60/32Y02B60/1282Y02D10/00Y02D30/50
Inventor S·谭S·拉哈克里什南B·A·滕南特J·巴尔拉A·科克
Owner INTEL CORP