Component built-in circuit substrate and method of producing the same

Abstract

A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of connecting terminals; a solder part joining between electrodes and connecting terminals; and a sealing resin part filling a gap between the bottom surface of the electronic component and the front surface of the core layer and covering the resist and the solder part, to prevent a defect of a component built-in printed circuit substrate.

Description

technical field [0001] The present invention relates to a component-embedded wiring board and a method of manufacturing the component-embedded wiring board, which is constituted by laminating a plurality of wiring layers, and electronic components are mounted on a core layer, which is an inner layer thereof. Background technique [0002] In recent years, as electronic devices have become more functional and miniaturized, mounting substrates on which electronic components have been mounted tend to require higher mounting density. Therefore, as a printed wiring board for mounting electronic components, a so-called built-in component structure is used in which electronic components are mounted on an inner layer (core layer) of a plurality of laminated wiring layers (for example, refer to Patent Document 1). . Patent Document 1 exemplifies an example in which a chip component (electronic component with a pair of terminals) such as a chip capacitor is mounted on an inner layer o...

AI Technical Summary

Problems solved by technology

Since the roughening treatment is carried out with chemical solutions such as strong acid or strong alkali, damage to the solder resist in the exposed state cannot be avoided in this roughening process.

In addition, in the lamination and heating process for forming the interlayer insulating layer, resin incompletely enters the solder resist non-formed part existing between the mounting regions, and there is a tendency to cause poor filling.

In addition, when there is such a filling failure, if the reheating for mounting the electronic component on the surface is performed as it is, there will be problems such as remelting of the solder of the joint terminal and generation of a bridge that short-circuits between the terminals.

In this way, due to the formation method of the solder resist, various problems occur on the conventional component-embedded wiring board with embedded chip components.

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