Unlock instant, AI-driven research and patent intelligence for your innovation.

Substrate cleaning chamber and components

A technology for cleaning chambers and substrates, used in electrical components, semiconductor/solid-state device manufacturing, vacuum evaporation plating, etc., to solve problems such as uneven heating, corrosion of stainless steel walls and gaskets, and scratching of substrates.

Active Publication Date: 2010-06-09
APPLIED MATERIALS INC
View PDF1 Cites 19 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This corrosion damages the components, and if the component is an integral part of the chamber, the chamber must be closed so that the component can be refurbished or replaced after a predetermined number of process cycles, which is not ideal
Known stainless steel walls and liners are particularly susceptible to corrosion requiring frequent replacement or refurbishment
[0007] Yet another problem occurs when the substrate heating pedestal that contacts the substrate within the cleaning chamber transfers contaminants and process residues and deposits to the back of the substrate or even scratches the substrate during the substrate transfer process
Substrate heating mounts that contain heating elements may also provide uneven heating across the surface of the substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate cleaning chamber and components
  • Substrate cleaning chamber and components
  • Substrate cleaning chamber and components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0070] FIG. 1 illustrates an embodiment of a substrate tool 20 including a cleaning chamber 24 adapted to clean a substrate 22 . The cleaning chamber 24 as shown is suitable for cleaning substrates 22, such as semiconductor wafers; however, the cleaning chamber 24 can be adjusted by those skilled in the art to be suitable for cleaning other substrates 22, such as flat panel displays, polymer panels, or other circuit containing structures. Accordingly, the scope of the present invention should not be limited to the exemplary embodiment of the clean chamber shown herein. Generally, the cleaning chamber 24 includes one or more surrounding walls 30 , which may include an upper wall 32 , side walls 34 , and a bottom wall 36 , and which enclose a processing area 38 . The gas inlet 40 of the cleaning chamber 24 is supplied with energized cleaning gas from a remote chamber 42 . The cleaning gas reacts with the substrate 22 and other surfaces within the chamber 24 . Exhaust gases an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

A substrate cleaning chamber comprises various components, such as for example, a consumable ceramic liner, substrate heating pedestal, and process kit. The consumable ceramic liner is provided for connecting a gas outlet channel of a remote gas energizer to a gas inlet channel of a substrate cleaning chamber. The substrate heating pedestal comprises an annular plate having a substrate receiving surface with a plurality of ceramic balls positioned in an array of recesses. A process kit comprises a top plate, top liner, gas distributor plate, bottom liner, and focus ring.

Description

technical field [0001] The present invention relates to substrate cleaning chambers and components thereof. Background technique [0002] In substrate processing such as semiconductors and displays, layers are formed on the substrate and then etched to form features such as conductive interconnects, contacts, vias, gates and barriers. For example, an electrical interconnect can be patterned by depositing a metal-containing conductor on the substrate, forming a patterned etch-resistant material on the conductor, etching the conductor to form the interconnect, removing residual photoresist, and The etched features are fabricated by depositing a dielectric layer. The dielectric layer may be further etched to form contact holes or vias that expose underlying metal-containing conductive material or other substrate layers. Conductive material is then deposited into the etched holes or trenches to electrically contact the underlying conductors. For example, in the formation of c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32C23C14/02
CPCH01J2237/0268H01J37/3244H01J37/32477H01J37/32871H01J37/32357H01J2237/0213H01J2237/2001H01J2237/335Y10T29/49826H01J37/32724H01L21/67028H01L21/67069H01L21/67103H01L21/67207
Inventor M·瑞克W·W·王
Owner APPLIED MATERIALS INC