Integrated radiating packaged LED
An integrated, body-based technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as poor heat dissipation, bulky overall, and unfavorable commodity popularization, etc.
Inactive Publication Date: 2010-06-16
官有占 +1
View PDF0 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] However, the crystal 3 of the light-emitting diode will generate heat during the photoelectric action process, and this heat will be transferred to the electrode member 2 and the thermal pillow 6. The thermal pillow 6 is only flat against the surface of the radiator 7, and its heat dissipation is often not ideal.
[0004] Especially recently, the power of light-emitting diodes is gradually increasing the power, or combining multiple light-emitting diodes in series or parallel to increase the power. Compared with the conventional light-emitting diodes, aluminum plates are used to dissipate heat, and lighting fixtures require more power or integration and combination Increased power is particularly inadequate compared to the heat dissipation structure of the aluminum plate. The volume of the heat dissipation structure of the aluminum plate must be greatly increased, causing the overall volume to be too large, which is not conducive to the popularization of products and limits the development of LED lighting fixtures; so if there is a heat dissipation structure that meets the era of small volume If it is trendy, it can not only solve the lack of common use, but also become a product that the public is willing to accept, and it is the primary task that the industry is eager to solve
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0026] The present invention integrates heat dissipation LED package, the first preferred embodiment, please refer to figure 2 , 3 , 4, its general manufacturing method is as follows, its composition structure is composed of a body 20, a crystal 30, a heat dissipation member 40 and an optical assembly 50:
[0027] see figure 2 As shown, a ceramic ionic compound is selected, which is made of a cooling material 101 with 50% of aluminum oxide, 12% of magnesium oxide, 12% of zinc oxide, 5% of silicon dioxide and 21% of various semiconducting metal oxides; The cooling material 101 is finely processed to powder particles above 60 nanometers, and at the same time, the cooling material 101 has liquid flow characteristics; ceramic ionic compounds can also be other existing products, which are not the invention point of the present invention, and the above is only is an example.
[0028] see figure 2 As shown, the refrigeration material 101 is placed in a container to form a semi...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides an integrated radiating packaged LED, which guides pressure to a liquid-phase refrigeration material. The base of a main body is finely homogenized for molding so that molecules are arranged tidily in the same direction, the base can be tightly and fixedly combined with a joint part, a crystal is arranged on the base, and the main body is connected with a heat-conducting component. The main body and the heat-conducting component form great temperature difference, the base and the heat-conducting component form excellent heat-absorbing effect, and the crystal can achieve temperature control work and ensure degree of stability and safety.
Description
technical field [0001] The present invention relates to a lighting appliance, more specifically, it refers to an LED body pre-pressurized and homogeneously molded and packaged with a heat-dissipating component to increase heat absorption and heat-dissipating effects and improve safety in use. Background technique [0002] General customary light-emitting diode (LED) assembly and use, please refer to figure 1 Shown, all only use the base 1 of engineering plastics to embed an electrode member 2 to connect the circuit and use for conducting current, but the crystal 3 of the light-emitting diode is fixed on the central seat 4 of the base 1, and the center of the base 1 A fluorescent powder layer is coated on the base 4 to cover the crystal 3, and the light emitted by the crystal 3 is provided to adjust the white light irradiation. At the same time, an insulating layer 5 is arranged on the bottom side of the base 1 to separate the thermal pillow 6 at the bottom, and the thermal p...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
Inventor 官有占张云联
Owner 官有占