Unlock instant, AI-driven research and patent intelligence for your innovation.

Polishing wheel set, polishing device and polishing system

A brushing wheel and brushing technology, which is applied in the field of brushing wheel sets, grinding systems, and grinding devices, can solve problems such as increased labor intensity, physical and mental fatigue of staff, and adverse effects of production environments, so as to reduce labor intensity Effect

Inactive Publication Date: 2012-09-26
AVARY HLDG (SHENZHEN) CO LTD +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the grinding process, a large amount of grinding dust is scattered, which has a bad impact on the production environment and affects the health of the staff
In addition, in order to meet the efficiency of production, the time of brushing is limited, so the labor intensity increases, causing the physical and mental fatigue of the staff

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polishing wheel set, polishing device and polishing system
  • Polishing wheel set, polishing device and polishing system
  • Polishing wheel set, polishing device and polishing system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] The brush wheel set, the brush device and the brush system of the technical solution will be described in detail below with reference to the drawings and multiple embodiments.

[0016] Please also refer to figure 1 and figure 2 , The first embodiment of the technical solution provides a brush wheel set 100 , which includes a saddle 110 , a guide bearing 120 , a guide shaft 130 , a mounting seat 140 , a brush member 150 and an elastic element 160 .

[0017] The saddle 110 has a bottom plate 111 , a top plate 112 opposite to the bottom plate 111 , a first side plate 113 , a second side plate 114 and a third side plate 115 opposite to the second side plate 114 . The first side plate 113, the second side plate 114 and the third side plate 115 are all connected between the bottom plate 111 and the top plate 112, the first side plate 113 is connected between the second side plate 114 and the third side plate 115, and The first side plate 113 , the second side plate 114 and...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a polishing device, which comprises at least one polishing wheel set; a base provided with a first sliding rail, wherein the polishing wheel set is slidably mounted onto the first sliding rail; a first driving unit for driving the polishing wheel set to perform a reciprocating motion along the first sliding rail; a mounting plate provided with a second sliding rail, wherein the polishing wheel set is mounted on the mounting plate; and a second driving unit. The saddle of the polishing wheel set is provided with a second sliding chute and the second sliding rail is accommodated inside the second sliding chute. The second driving unit is used for driving the polishing wheel set to slide along the second sliding rail. The invention also relates to a polishing system.

Description

technical field [0001] The invention relates to a brushing device, in particular to a brushing wheel set, a brushing device and a brushing system. Background technique [0002] A multilayer printed circuit board is a printed circuit board in which more than two layers of conductive lines and insulating materials are alternately bonded together and the interlayer conductive lines are interconnected according to design requirements. Multilayer printed circuit boards have been widely used because of their advantages such as high assembly density, see literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res. density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] Multi-layer circuit boards are usually formed by laminating single-sided panels, double-sided panels, cover layers, and adhesive layers. However, in the pressing process, usually a plurality of circu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B24B27/033B24B41/04
Inventor 廖新治廖道明陈文村沈家弘张林定
Owner AVARY HLDG (SHENZHEN) CO LTD
PatSnap Eureka logo

PatSnap Eureka turns technology decisions into work you can execute. Powered by our Innovation Knowledge Graph, it runs expert workflows across engineering, life sciences, materials and intellectual property. Get your review-ready output in minutes.

X (Twitter)LinkedInYouTubeSubstack

© 2026 PatSnap. All rights reserved. 

Terms of Service

 | 

Privacy policy

 | 

Modern Slavery Act Transparency Statement