Automatic device for installing rectifier bridge chip

Abstract

The invention discloses an automatic device for installing a rectifier bridge chip. The automatic device comprises an automatic frame placing device for automatically grasping and placing a frame on amold; a colloid screen printer including a screen printing cylinder, a filter net and a colloid scraping head, wherein the displacement of the colloid scraping head is controlled by the screen printing cylinder; a chip adsorption and placing instrument including a chip cylinder, a chip adsorption and placing head and a powerful chip adsorber, wherein the displacement of the chip adsorption and placing head is controlled by the chip cylinder, the inside of the chip adsorption and placing head is a hollow structure, the top of the hollow-structured chip adsorption and placing head communicateswith the powerful chip adsorber, and the bottom of the chip adsorption and placing head is provided with an adsorption and placing port; and a mold base and a base slide rail, wherein the mold base isslidably mounted on the base slide rail through a pulley, one end of the mold base is connected with a base movement cylinder, and the base movement cylinder controls the motion displacement of the mold base.

Description

technical field [0001] The invention relates to the field of rectifier bridge preparation devices, in particular to an automatic equipment for rectifier bridge chip installation. Background technique [0002] The rectifier bridge is to seal the rectifier tube in a shell, divided into full bridge and half bridge, the full bridge is to seal the four diodes of the connected bridge rectifier circuit together, and the half bridge is to rectify the four diode bridges Half sealed together, two half-bridges can be used to form a bridge rectifier circuit, and one half-bridge can also be used to form a full-wave rectifier circuit with a transformer and a center tap. The rectifier circuit and operating voltage should be considered when selecting a rectifier bridge. The preparation process of the rectifier bridge is as follows: first, apply glue on the lower metal frame, then place the chip on the lower metal frame, and finally close the upper metal frame for die-cutting. In the past, ...

AI Technical Summary

Problems solved by technology

In the past, the chip placement and gluing processes were all done manually. The purely manual operation not only caused a certain workload on the workers, but also affected the efficiency of the rectifier bridge manufacturing process.

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