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Lug boss top opening type tin overflowing pot opening

A technology of overflowing tin and pot opening, which is applied in the direction of assembling printed circuits with electrical components, etc., can solve the problems of low work efficiency, easy formation of virtual welding of contacts, unsuitable for large-scale batch processing, etc., to ensure adequacy and firmness. Effect

Inactive Publication Date: 2010-06-30
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. The invention provides a tin furnace spout with simple structure, which can effectively improve welding efficiency and ensure the quality of welding joints

Method used

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  • Lug boss top opening type tin overflowing pot opening
  • Lug boss top opening type tin overflowing pot opening
  • Lug boss top opening type tin overflowing pot opening

Examples

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Embodiment Construction

[0012] Such as figure 1 Shown is a kind of overflowing tin spout with an upward opening on the boss, the spout is composed of a base body 2 and an insertion port 3, a step 4 is formed between the base body 2 and the insertion port 3, and a The tin overflow opening 1 is a rectangular opening with a depth of 3-6 mm.

[0013] Such as figure 2 As shown, the insertion port 3 is provided on the base body 2, which is more convenient for the insertion port 3 to go deep into the electronic components 5 on the PCBA board 6 . The tin overflow port 1 arranged on the insertion port 3 is designed in a triangular shape. When the tin liquid flows out from the tin overflow port 1, the triangular shape of the tin outlet hole 1 also plays a good role in diversion.

[0014] When in use, place the PCBA board at a predetermined position above the spout, and keep a certain distance between the plane of the board and the tin outlet of the spout, generally controlled at 2-4mm. The shape of the spo...

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Abstract

The invention relates to a tin furnace component used for PCBA board soldering tin, in particular to a lug boss top opening type tin overflowing pot opening, which consists of a base body and an insertion hole, wherein a step is formed between the base body and the insertion hole, a tin overflowing hole is arranged at an edge opening of the insertion opening, and the tin overflowing opening is a rectangular notch with the depth between 3 and 6 mm. The invention has a simple structure, can effectively improve the welding efficiency, and is suitable for large-scale automatic production. In addition, the invention effectively avoids the oxide layer of the tin liquid surface layer remaining on the surface of a PCBA board, and ensures the quality of welding points.

Description

technical field [0001] The invention relates to a tin furnace part used for soldering of PCBA boards, in particular to a tin overflow spout with an upward opening of a boss. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the mouth of the pot, which leads to a large area of ​​false soldering; for PCBA boards with denser solder joints, there are also pot mouth structures, but the usual tin furnace pot mouth is designed as a flat mouth, in order to realize PCBA board Soldering operation generally needs to keep a distance between the PCBA board and the spout. On the one hand, it is ensured that the tin liquid sprayed from the spout can solder the electrical components on the PCBA board above, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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