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Fixed kettle mouth

A fixed, pot-mouth technology, applied in the direction of assembling printed circuits with electrical components, can solve problems such as low work efficiency, easy to form false soldering of contacts, and is not suitable for large-scale batch processing, so as to ensure sufficient and firmness Effect

Inactive Publication Date: 2010-06-30
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. The invention provides a tin furnace spout with simple structure, which can effectively improve welding efficiency and ensure the quality of welding joints

Method used

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Examples

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Embodiment Construction

[0013] Such as figure 1 A fixed spout is shown, the mouth of the spout is provided with a cylindrical socket 1, and at least one overflow tin opening 2 is provided on the edge of the cylindrical socket 1, and the overflow tin opening 2 is a The rectangular notch has a depth of 3-6 mm, and a tin overflow slope 5 is provided at the tin overflow opening 2 . A base 3 is provided at the bottom of the cylindrical socket 1 , and a spout fixing hole 4 is provided on the base 3 .

[0014] Such as figure 2 As shown, before welding, the base 5 and the tin outlet of the tin furnace are fixedly connected through the spout fixing hole 4, and the opening position of the overflow tin opening 2 is determined according to the distribution of the electronic components 6 outside the spout. There are no electronic components 6 on the PCBA board 7 outside the tin port 2 or are relatively far away, so that the tin liquid flowing out from the tin overflow port 2 will not spread and overflow other ...

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Abstract

The invention relates to a solder stove component for soldering tin of PCBA plates, in particular to a fixed kettle mouth, which is characterized in that the mouth of the kettle mouth is provided with a cylindrical jack, and at least one tin overflowing opening is arranged on the edge of the cylindrical jack; the tin overflowing opening is of a rectangular gap, and the depth of the opening is 3 to 6mm; a tin overflowing inclined surface is arranged on the tin overflowing opening, and a base is arranged at the bottom of the cylindrical jack; and kettle mouth fixing holes are arranged on the base. The invention has simple structure, can effectively improve soldering efficiency, is suitable for large-scale automatic production, effectively prevents the oxide surface of a tin liquid surface layer from be remained on the surface of the PCBA plate, and ensures the quality of soldering contacts.

Description

technical field [0001] The invention relates to a tin furnace part used for PCBA board soldering, in particular to a fixed spout. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the mouth of the pot, which leads to a large area of ​​false soldering; for PCBA boards with denser solder joints, there are also pot mouth structures, but the usual tin furnace pot mouth is designed as a flat mouth, in order to realize PCBA board Soldering operation generally needs to keep a distance between the PCBA board and the spout. On the one hand, it is ensured that the tin liquid sprayed from the spout can solder the electrical components on the PCBA board above, and at the same time, it is guaranteed to be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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