Spray cup for electrode plating of silicon solar cell

Abstract

The invention discloses a spray cup for electrode plating of a silicon solar cell, which solves the problem of the low ratio of the area occupied by polysilicon of a single solar cell and the area occupied by a printed wire in the prior art. The spray cup comprises a basin-shaped lower spray cup chamber (23), a basin-shaped upper spray cup chamber (24) arranged on the lower spray cup chamber (23)upside down and a conductive needle fixing and adjusting mechanism (25), a plating anode fixing frame (26) and a plating anode net (27) are fixedly arranged in the lower spray cup chamber (23), the outer body of the lower spray cup chamber (23) is provided with a plating anode leading-out column (35) and a plating solution inlet; the basin bottom of the upper spray cup chamber (24) is a plated polysilicon film (20) arranged in the position of the basin bottom, and the overflow eave (28) of the upper spray cup chamber (24) is correspondingly provided with a pair of conductive needle fixing andadjusting mechanisms (25). The invention can conveniently realize the plating of silicon wafers of 125 multiplied by 125 and 156 multiplied by 156.

Description

technical field [0001] The present invention relates to an electroplating equipment, in particular to an electrode electroplating spray cup used on solar cell electrode electroplating equipment. The spray cup is installed on silicon solar cell electrode metallization equipment and is used for silicon solar cell The electrodes are electroplated. Background technique [0002] The production process of solar cells is to first cut crystalline silicon into silicon wafers, and then use screen printing technology to print silver paste into grid line electrodes after the cut silicon wafers are processed by various processes. The interval between the printed grid lines on the silicon wafer should not be too small, and the width of the screen printed grid lines on the silicon wafer should not be too narrow, so that the wires on the solar cell printed by silver paste printing technology and the silicon wafer The area ratio is large; at the same time, the silver paste is doped with org...

AI Technical Summary

Problems solved by technology

[0003] The electrode electroplating spray cup for silicon solar cells provided by the present invention solves the problem that the area ratio of the wires on the solar cell to the silicon chip is large in the prior art, and at the same time, the silver paste is doped with organic matter, which will reduce the conductivity of the silicon chip , a technical problem caused by the disadvantage of low solar energy conversion efficiency of silicon wafers

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