Electroplating equipment for electrode of silicon solar cell slice

Abstract

The invention discloses electroplating equipment for an electrode of a silicon solar cell slice, solving the problems of small area ratio between polycrystalline silicon occupied area and impressed lead area and poor coating quality of a single solar cell slice in the prior art. The equipment comprises a plurality of groups of electroplate liquid troughs (38), electroplate liquid pumps and delivery lines (39) and electroplated rectifiers power supplies (43) which are arranged in a frame (37) and are mutually independent, a travelling crane guide rail (41) and a delivering trolley (42) are arranged on the inner top of a sealed cover body (40), a plurality of groups of the electroplating liquid troughs (38), spraying cups (36) and conductive needle fixation and regulation mechanisms (25) are arranged between a charging position and a discharging position, the lower cavity (23) of the spraying cup is fixedly provided with an electroplating anode fixing frame (26) and an electroplating anode net (27), and the outer cavity of the lower cavity (23) of the spraying cup is provided with an electroplating anode extraction column (35) and an electroplate liquid inlet, thus improving the quality of the single polycrystalline silicon slice.

Description

technical field [0001] The invention relates to an electroplating device, in particular to a device for electroplating electrodes of silicon solar cells. Background technique [0002] The production process of solar cells is to first cut crystalline silicon into silicon wafers, and then use screen printing technology to print silver paste into grid line electrodes after the cut silicon wafers are processed by various processes. The interval between the printed grid lines on the silicon wafer should not be too small, and the width of the screen printed grid lines on the silicon wafer should not be too narrow, so that the wires on the solar cell printed by silver paste printing technology and the silicon wafer The area ratio is large; at the same time, the silver paste is mixed with organic matter, which will reduce the conductivity of the silicon wafer, which leads to the disadvantage of low solar energy conversion rate of the silicon wafer. In addition, because the coplanar...

AI Technical Summary

Problems solved by technology

[0003] The electrode electroplating spray cup for silicon solar cells provided by the present invention solves the problem of the large area ratio between the wires on the solar cell and the silicon chip in the prior art, and at the same time, the silver paste is mixed with organic matter, which will reduce the conductivity of the silicon chip. , resulting in the disadvantages of low solar energy conversion rate of silicon wafers, uneven electroplating layer and high production cost technical problems

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