Technology for aligning circuit board by PIN nail

Abstract

The invention discloses technology for aligning a circuit board by a PIN nail, and belongs to the field of manufacture of circuit boards. The technology comprises the following steps: (A) drawing patterns to be transferred on a film on which a processing line and a molding line are set; (B) forming a PIN nail positioning hole at the corner position of the processing line, wherein one side has 1 to 3 holes more than the other sides; (C) arranging the PIN nail in the PIN nail positioning hole; (D) forming a film window at the edge position of 2 to 5mm of the PIN nail hole and adhering a gummed paper, and sealing the sides of the film; and (E) performing aligned production of the circuit board according to the PIN nail. By adopting the technology, the circuit boards can be directly produced by using a black film without copying the black film into a yellow film and substantial cost can be saved. Due to the adoption of the technology for aligning the circuit board by the PIN nail, the efficiency can be improved to 80 to 90 pnl per hour. Due to the adoption of the PIN nail, the operating difficulty for aligning personnel is reduced greatly.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a processing technology of a circuit board using PIN nail alignment. Background technique [0002] Multilayer printed circuit boards have played a pivotal role in the rapid development of the electronics industry. When making multilayer circuit boards, it is necessary to combine copper foil (Copper Foil), film (Prepreg) and oxidation treatment (Oxidation) The inner layer core board is pressed into a multi-layer substrate. The lamination process mainly includes inner layer oxidation treatment, lay-up (Lay-up), lamination, and post-treatment. In the process of lay-up, the inner layer The alignment of the core board group is the most important. When multilayer printed circuit boards are performing multilayer inner core board group lamination (Lay-up) operation, the traditional method is to use the edge alignment of the inner layer core board group of th...

AI Technical Summary

Problems solved by technology

When multilayer printed circuit boards are performing multilayer inner core board group lamination (Lay-up) operation, the traditional method is to use the edge alignment of the inner layer core board group of the printed circuit board to laminate the board. Often due to the irregularity of the plate edge or the accidental operation, the alignment of the inner core plate group and the multiple sets of inner core plate groups on the other steel plates is not accurate, resulting in inconsistent plate thickness, white edges and white corners and other quality defects.

And the traditional alignment method can only use Huang Feilin as the carrier of the graphics, and transfer the graphics of the circuit board to the PCB substrate with a photosensitive film by manual alignment, which is difficult to achieve precise positioning

Moreover, when choosing film, the follow-up process must be completed after copying black film into yellow film and protecting it with a film. The process is also relatively complicated and the processing cost will be high.