Reflective optical encoder package and method
A technology of reflective optics and encoders, applied in the field of optical encoders
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[0015] In various embodiments of the invention, wafer-level packaging is employed to provide a glass layer disposed above or below an integrated circuit having photodetectors or light emitters disposed in or on it. Corresponding assemblies, apparatus, systems, and methods are also provided. Various embodiments of the present invention allow for the provision of reflective optical encoder packages with small dimensions.
[0016] Figure 1(a) illustrates a top perspective view of one embodiment of a reflective optical encoder. Figure 1(b) illustrates a side view of the reflective optical encoder package of Figure 1(a). Included in the package 10 of Figures 1(a) and 1(b) is an integrated circuit 20 that includes a photodetector 30 formed on or near a first substantially planar upper surface 50 thereof. Integrated circuit 20 also includes at least one recess 70 formed in or near first surface 50 . The recessed portion 70 is configured to receive light from the light emitter 40 ....
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