Chip-type solid discharging tube
A solid discharge tube, patch technology, applied in the direction of electric solid devices, circuits, electrical components, etc.
Inactive Publication Date: 2010-07-21
上海金克半导体设备有限公司
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Problems solved by technology
[0006] The technical problem to be solved by the present invention is to provide a patch solid discharge tube with a new structure, so as to fundamentally solve the problems that cannot be solved by the existing patch solid discharge tube
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[0017] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further elaborated below in conjunction with specific illustrations.
[0018] see Figure 4 , Figure 4 It is a schematic diagram of the internal structure of the patch type solid discharge tube of the present invention. It can be seen from the figure that the patch type solid discharge tube includes a housing 300 made of packaging materials, a wafer 400 located in the housing 300 and two lead sheets, wherein the two lead sheets are divided into left and right lead sheets 100, 200, one end of the left and right lead pieces 100, 200 protrudes into the housing 300 to form welding ends 110, 210, and the welding ends 110, 210 are arranged coaxially. The wafer 400 is perpendicular to the axis 500 of the patch type solid discharge tube, and the welding ends 110, 210 are located outside the welding surfaces 410, 420 on...
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The invention relates to a chip-type solid discharging tube, which comprises a shell which is formed by an encapsulation material, and a wafer and a left and a right lead pieces, which are arranged inside the shell, wherein one end of the left and the right lead pieces extend into the shell, and the other end of the left and the right lead pieces are arranged outside the shell to form a bending part; and the wafer is vertical to the axis of the chip-type solid discharging tube, the section of the left and the right lead pieces which extend into the shell is of a welding end, two welding ends are arranged outside a welding surface at two sides of the wafer, and the head of the welding ends of the left and the right lead pieces is provided with a nail head which is welded with the welding surfaces at two sides of the wafer. Since the periphery of the wafer is free from having the lead part, the corner of the wafer is free from the inadequate discharging gap problem between the lead pars whether the wafer is deflected horizontally and deflected vertically, so the quality decrease problem of the chip-type solid discharging tube caused by the horizontal deflection and the vertical deflection of the wafer can be fundamentally solved, and the encapsulation efficiency and the quality rate of the chip-type solid discharging tube can be greatly improved.
Description
technical field [0001] The invention relates to the technical field of semiconductor device packaging, in particular to a patch type solid discharge tube. Background technique [0002] Solid discharge tube is also called semiconductor discharge tube: it is an overvoltage protection device, which is made of the principle of thyristor. It relies on the breakdown current of the PN junction to trigger the device to conduct and discharge, and it can flow a large surge current or pulse current. . The range of its breakdown voltage constitutes the range of overvoltage protection. When the solid discharge tube is used, it can be directly connected across the two ends of the protected circuit. [0003] The world's electronic products such as telephones, televisions, fax machines, and computer peripheral products should be light, thin, and small as the research and development goals, so the volume of the solid discharge tube is required to be as small as possible. In order to adapt...
Claims
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IPC IPC(8): H01L23/49
CPCH01L2924/01082H01L24/01H01L2924/1301
Inventor 林茂昌
Owner 上海金克半导体设备有限公司