Fully encapsulated type packaging structure of assembled heat dissipation block with mount pad embedded chip

Abstract

The invention relates to a fully encapsulated type packaging structure of an assembled heat dissipation block with a mount pad embedded chip. The fully encapsulated type packaging structure comprises a chip (3), a metal mount pad (1) supported by the lower side of the chip, an inner metal pin (4), a metal wire (5) for the signal connection from the chip to the inner metal pin, a conductive or non-conductive heat conducting adhesive matter I (2) and a plastic sealing body (8) between the chip and the metal mount pad; the metal mount pad (1) is embedded in the plastic sealing body (8), wherein a heat dissipation block (7) is arranged above the chip (3); a conducive or non-conductive heat conducting adhesive matter II (6) is embedded between the heat dissipation block (7) and the chip (3); and the heat dissipation block (7) is totally encapsulated in the plastic sealing body (8). The heat dissipation block is additionally arranged above the chip to dissipate high heat, so that the invention provides the strong heat dissipation ability and makes the heat of the chip rapidly transmit outside the packaging body. The invention prevents the chip from rapidly aging even burning or burning-out.

Description

(1) Technical field [0001] The invention relates to a full-cover packaging structure of a base island embedded in a chip and a heat dissipation block. It belongs to the technical field of semiconductor packaging. (2) Background technology [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet used (such as figure 1 and figure 2 As shown), the effective area and volume of the metal-based island are very small, and at the same time, ...

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

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