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Heat dissipation structure of high-power LED module

A technology of LED module and heat dissipation structure, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve problems such as burnout of electronic components, excessive heat generation of high-power LEDs, and short service life.

Inactive Publication Date: 2010-08-18
JIANGMEN LT LIGHTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For example, LED street lamps, LED car lights, LED lighting lamps, etc., because the LED light-emitting area is relatively small, and the luminous brightness is small, so when applying LEDs to LED street lights, LED car lights, LED lighting lamps, etc., generally use High-power LED, but because high-power LED generates more heat, it is easy to accumulate heat, which will burn out each LED and other electronic components, thus failing to achieve the effect of long service life

Method used

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  • Heat dissipation structure of high-power LED module
  • Heat dissipation structure of high-power LED module
  • Heat dissipation structure of high-power LED module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Such as figure 1 As shown, this embodiment provides a high-power LED module heat dissipation structure, the high-power LED module heat dissipation structure can be applied to high-power LED modules, for example, can be applied to LED street lamps, LED car lights, LED lighting lamps, etc. , the heat dissipation structure of this embodiment is mainly used to solve the heat dissipation problem of the high-power LED module.

[0026] The heat dissipation structure of the high-power LED module includes several light-emitting units, a heat dissipation plate and a temperature control device, and each light-emitting unit is fixed on the heat dissipation plate; each light-emitting unit includes one or more LEDs and controls the LEDs to emit light Each LED includes a red LED, a blue LED and a green LED, and each light emitting unit may include any one of the color LEDs, or any two color LEDs, or any three color LEDs.

[0027] The heat dissipation plate is a heat dissipation plate...

Embodiment 2

[0033] Such as figure 2 As shown, on the basis of the above examples, in the heat dissipation structure of the high-power LED module provided by this embodiment, the light emitting unit 204 also includes a PCB board 202, wherein a PCB board 202 can be provided corresponding to each light emitting unit 204 , or, only one PCB board 202 is set, and each light-emitting unit is fixed on the PCB board 202, and each PCB board 202 is fixed on the heat dissipation plate 201, and the heat dissipation plate 201 and the PCB board 202 They are fixed in contact with each other, and the PCB board is also provided with a number of first cooling holes 203, each of the first cooling holes 203 can increase the contact area between the PCB board 202 and the surrounding air, so that the heat of the PCB board 202 can be faster Heat dissipation, so that the heat dissipation effect is better.

[0034] For example, the heat dissipation plate 201 may be provided with a plurality of subordinate heat d...

Embodiment 3

[0036] Such as image 3 As shown, on the basis of the above examples, in the high-power LED module heat dissipation structure provided by this embodiment, the temperature detection unit includes one or more first sensors, and each first sensor is fixed on the light emitting unit. Internally, it is used to sense the first actual temperature of each LED in the light-emitting unit in real time, and send the first actual temperature data to the control unit. After the control unit receives the first actual temperature data, according to the The first actual temperature is used to control the PWM modulator, and the PWM modulator is used to adjust the input current of the light emitting unit, thereby reducing the generation of internal heat of the light emitting unit.

[0037] And, the temperature detection unit also includes one or more second sensors, each second sensor is fixed on the PCB board, and is used to sense the second actual temperature of the PCB board in real time, bec...

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PUM

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Abstract

The invention discloses a heat dissipation structure of a high-power LED module, comprising a luminous unit, a heat dissipation plate and a temperature control device; wherein the luminous unit comprises at least one LED and a control module thereof; the heat dissipation plate is made from graphite and fixed with the luminous unit; the temperature control unit comprises a control unit, a temperature detection unit, a PWM modulator and a radiator; the temperature detection unit is connected with the control unit and is used for monitoring actual temperature of the luminous unit and transmitting the actual temperature to the control unit; the control unit is respectively connected with the PWM modulator and the radiator and is used for controlling the PWM modulator and the radiator according to the actual temperature; the PWM modulator is used adjusting input current of the luminous unit and the radiator is fixed on the radiator and is used for accelerating air flow around the luminous unit.The invention features excellent heat dissipation effect.

Description

technical field [0001] The invention relates to the field of LED lighting devices, in particular to a high-power LED module heat dissipation structure. Background technique [0002] In the prior art, LED products are more and more popular among users due to their features of environmental protection, energy saving and long service life. At the same time, the application fields of LEDs are becoming more and more extensive. [0003] For example, LED street lamps, LED car lights, LED lighting lamps, etc., because the LED light-emitting area is relatively small, and the luminous brightness is small, so when applying LEDs to LED street lights, LED car lights, LED lighting lamps, etc., generally use High-power LEDs, but because high-power LEDs generate more heat, they tend to accumulate heat, which will burn out the LEDs and other electronic components, thus failing to achieve the effect of long service life. [0004] Therefore, there are defects in the prior art and need to be i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64
Inventor 商松
Owner JIANGMEN LT LIGHTING