Heat dissipation structure of high-power LED module
A technology of LED module and heat dissipation structure, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve problems such as burnout of electronic components, excessive heat generation of high-power LEDs, and short service life.
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Embodiment 1
[0025] Such as figure 1 As shown, this embodiment provides a high-power LED module heat dissipation structure, the high-power LED module heat dissipation structure can be applied to high-power LED modules, for example, can be applied to LED street lamps, LED car lights, LED lighting lamps, etc. , the heat dissipation structure of this embodiment is mainly used to solve the heat dissipation problem of the high-power LED module.
[0026] The heat dissipation structure of the high-power LED module includes several light-emitting units, a heat dissipation plate and a temperature control device, and each light-emitting unit is fixed on the heat dissipation plate; each light-emitting unit includes one or more LEDs and controls the LEDs to emit light Each LED includes a red LED, a blue LED and a green LED, and each light emitting unit may include any one of the color LEDs, or any two color LEDs, or any three color LEDs.
[0027] The heat dissipation plate is a heat dissipation plate...
Embodiment 2
[0033] Such as figure 2 As shown, on the basis of the above examples, in the heat dissipation structure of the high-power LED module provided by this embodiment, the light emitting unit 204 also includes a PCB board 202, wherein a PCB board 202 can be provided corresponding to each light emitting unit 204 , or, only one PCB board 202 is set, and each light-emitting unit is fixed on the PCB board 202, and each PCB board 202 is fixed on the heat dissipation plate 201, and the heat dissipation plate 201 and the PCB board 202 They are fixed in contact with each other, and the PCB board is also provided with a number of first cooling holes 203, each of the first cooling holes 203 can increase the contact area between the PCB board 202 and the surrounding air, so that the heat of the PCB board 202 can be faster Heat dissipation, so that the heat dissipation effect is better.
[0034] For example, the heat dissipation plate 201 may be provided with a plurality of subordinate heat d...
Embodiment 3
[0036] Such as image 3 As shown, on the basis of the above examples, in the high-power LED module heat dissipation structure provided by this embodiment, the temperature detection unit includes one or more first sensors, and each first sensor is fixed on the light emitting unit. Internally, it is used to sense the first actual temperature of each LED in the light-emitting unit in real time, and send the first actual temperature data to the control unit. After the control unit receives the first actual temperature data, according to the The first actual temperature is used to control the PWM modulator, and the PWM modulator is used to adjust the input current of the light emitting unit, thereby reducing the generation of internal heat of the light emitting unit.
[0037] And, the temperature detection unit also includes one or more second sensors, each second sensor is fixed on the PCB board, and is used to sense the second actual temperature of the PCB board in real time, bec...
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