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In-molded capacitive switch

An in-mold molding and capacitive technology, which is applied in the direction of electric switches, electronic switches, magnetic/electric field switches, etc., can solve the problems that capacitive switches cannot be integrated with profiling structures

Inactive Publication Date: 2010-08-18
INK LOGIX
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Nevertheless, known techniques for manufacturing capacitive switches are not suitable for integrating the switch with a three-dimensional supporting structure (user interface such as a control panel)
Furthermore, known capacitive switches cannot be easily integrated with profiling structures without using complex assembly and alignment processes

Method used

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Examples

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Embodiment Construction

[0016] The present invention relates to in-moulded switching devices. A preferred embodiment involves an in-molded capacitive switch. In addition, capacitive switches can also be in-molded into three-dimensional structures. As mentioned above, capacitive switches detect changes in capacitance due to switching disturbances.

[0017] In one embodiment, when a conductive or charged object, such as a finger, is placed close to the sensing area, a change in the capacitance of the sensing area indicates that a switching action has occurred. A sensing circuit detects a change in capacitance of the sensing region. For example, sensing circuitry can be tuned to detect specific changes in capacitance. For example, the sensing circuitry can be tuned to detect the proximity of a finger to the sensing area while not detecting other types of disturbances (eg, moisture). U.S. Patent No. 5,972,623, filed October 21, 1997, to applicants Gupta et al., titled "Solid Capacitive Switches," dis...

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PUM

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Abstract

An article of manufacture having an in-molded capacitive switch and method of making the same are shown and described. In one disclosed method, a conductive ink sensing zone is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.

Description

[0001] related application [0002] This application claims priority from US Provisional Patent Application No. 60 / 925,421, filed April 20, 2007, which is hereby incorporated by reference. technical field [0003] The present invention relates to a touch sensitive switch, and more particularly, to a capacitive switch molded in a plastic structure. Background technique [0004] Touch-sensitive switches are used, for example, in touchpads of household appliances (eg, stoves, washers, dryers, blenders, ovens, etc.), as well as portable devices (eg, IPODs, phones). Typical touch-sensitive switches utilize either resistive film sensing or capacitive sensing. Resistive film sensing utilizes two conductive resistive plates separated by a thin spacer. When a force is applied gently to one of the plates, making contact with the other, the resistance of the system increases. This in turn increases the voltage, which can be used to provide an output. This type of technique can be u...

Claims

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Application Information

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IPC IPC(8): H01G4/00
CPCB29C45/14655H03K2217/96019H03K2217/960755H03K17/962H03K2217/96079B29C45/14811H03K2217/960785H05K3/0014H05K3/12H05K3/284H05K2203/1316Y10T29/49105Y10T29/49117H01C1/06H01H36/00H05K3/30
Inventor 罗纳德·H·哈格
Owner INK LOGIX
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