Upright and close arrangement method and application device thereof for fins of cylindrical radiator

Abstract

The invention provides an upright and close arrangement method and an application device thereof for fins of a cylindrical radiator. The device comprises a die holder, a cylindrical shell and a fin set, wherein the die holder is driven by a power source to realize step-by-step swirl operation, the cylindrical shell is fixed on one end of the die holder, a plurality of grooves are arranged on surface around the cylindrical shell, and the fin set which comprises a plurality of fins is arranged on one end of the die holder; intermittent rotating cylindrical shell is used for driving the grooves and fins to pilot correspondingly and enabling a fin-inserting unit to propel rolling fins to be inserted into the grooves in order to position; and the subsequent close arrangement processing is carried out on the cylindrical shell with all grooves inserted with fins to closely combine the fins and groove together and position around the cylindrical shell so as to form a radiator. The invention has the advantages of higher precision, better quality, sounder production efficiency and convenience.

Description

technical field [0001] The invention relates to a method for planting and fastening the fins of a cylindrical radiator and its application device, especially to a radiator applied to computers or electronic components, which uses a mold base to drive a cylinder to produce intermittent rotation, and cooperates with The corresponding placement of the moving fins, as well as the formed planting and fastening method and structure can improve its precision, quality, better production efficiency and convenience. Background technique [0002] Traditional cylindrical heat sinks used in the technical field of computers or electronic components mainly include a cylinder and many fins welded on the surrounding surface of the cylinder. However, the welding method is time-consuming, laborious and not environmentally friendly. Another example is the Taiwan No. M317539 patent case of China, which adopts a sheath to cover and surround the heat dissipation module including a plurality of hea...

AI Technical Summary

Problems solved by technology

[0002] Traditional cylindrical heat sinks used in the technical field of computers or electronic components mainly include a cylinder and many fins welded on the surrounding surface of the cylinder, but the welding method is time-consuming and labor-intensive and not environmentally friendly.

Another example is the Taiwan No. M317539 patent case of China, which adopts a sheath to cover and surround the heat dissipation module including a plurality of heat dissipation fins, and at the same time position the heat dissipation module and the cylindrical heat conduction column, but in the above-mentioned In the structure, the heat dissipation module and the heat conduction column have a large bonding gap, which cannot be fully sealed, resulting in high thermal resistance, and cannot transfer the heat from the heat source to the heat conduction column, and effectively conduct heat to the heat dissipation module for heat dissipation. The heat dissipation efficiency is low and cannot be effectively Heat dissipation, resulting in temperature rise effect, damages diode lamps or other electronic components and reduces service life

[0003] In order to solve the above-mentioned deficiency, the applicant improved and innovated, and invented the new patent No. M345951 of Taiwan, China, which mainly includes an annular body 10 and a plurality of cooling fins 20 (referring to FIG. 1 ), and the annular body 10 has a plurality of guide fins. Grooves 11 and grooves 12 are combined with a plurality of cooling fins 20 correspondingly inserted along the grooves 12 of the annular body 10, and then punched by a molding die 30 to deform the guide grooves 11 and squeeze them toward the grooves 12, The groove 12 is riveted together with the fins 20; however, in the above-mentioned structure, the plurality of fins 20 are combined into one and then inserted into the groove 12, and the density required is quite high. If any fin 20 cannot If it is inserted and positioned corresponding to the groove 12, it cannot be integrated by stamping with the molding die 30, and its production efficiency is low, and its production capacity and yield are not ideal, so it needs to be improved.

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