A resin molded product production process has a resist pattern formation step including formation of the first resist layer on s substrate, positioning of the substrate and a mask A, exposure of the first resist layer using the mask A, heat-treatment of the first resist layer, formation of the second resist layer on the first resist layer, positioning of the substrate and a mask B, exposure of the second resist layer using the mask B, heat-treatment of the second resist layer, and development of the resist layers, thereby creating a given resist pattern. The production process further has a metal structure formation step of depositing a metal on the substrate in accordance with the resist pattern by plating, and a molded product formation step of forming a resin molded product by using the metal structure as a mold. A resin molded product is thereby produced.