Sintered flat plate heat pipe and manufacturing method thereof

Abstract

The invention relates to a sintered flat plate heat pipe. The sintered flat plate heat pipe comprises a metal shell and a porous capillary structure arranged inside the metal shell, wherein the metal shell is a sealed flat shell, and the porous capillary structure is connected with two inner walls of the sealed flat shell. The sintered flat plate heat pipe can save a support structure in the prior art so as to avoid the problems of pipe expansion and steam flow disturbance caused by the support structure. The invention also relates to a manufacturing method for the sintered flat plate heat pipe. The manufacturing method comprises the following steps of: A, cutting a hollow metal pipe with predetermined size and two open ends; B, beating the hollow metal pipe to form a flat shape; C, inserting a central bar into the metal pipe and filling metal powder into the flat metal shell; D, molding the filled metal powder into the porous capillary structure with sintering; and E, extracting the central bar, pressing and sealing the two ends of the metal pipe, and the like. The heat pipe obtained by the manufacturing method does not need to be welded with the support structure so as to avoid the problems of pipe expansion and steam flow disturbance caused by the support structure.

Description

technical field [0001] The invention relates to a heat transfer element and a manufacturing method thereof, in particular to a novel sintered flat heat pipe and a manufacturing method thereof. Background technique [0002] With the rapid development of electronic technology, the integration of transistors is getting higher and higher, and the heat generated by chips is increasing day by day, and electronic heat dissipation technology has gradually attracted attention. At present, the electronic heating problem has the following trends. The heat flux density is high, especially the local heating value is large, and the heat flow distribution is uneven, causing hot spots, such as the heat dissipation problem of high-power LEDs. In addition, during the start-up process of electronic equipment, the power is prone to surge instantaneously. This is the heat dissipation problem that electronic components must face when they operate at high frequency and develop at a high speed. ...

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the problems in the above prior art that support structures need to be provided in the flat heat pipes to disturb the flow of steam, and cause tube expansion and deformation in subsequent applications, the present invention provides a sintered flat heat pipe without support structures, which includes A metal shell and a porous capillary structure inside it, the metal shell is flat and sealed at both ends to form a sealed flat shell, the porous capillary structure is connected to the two inner walls of the sealed flat shell

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