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RF-IC packaging method and circuits obtained thereby

A technology of integrated circuits and inductors, applied in the field of RF-IC packaging, can solve the problems of increasing complexity, reducing Q factor, and complex requirements of low magnetic field inductors

Inactive Publication Date: 2010-09-22
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0023] Problems and disadvantages of low field inductors proposed today to minimize unwanted magnetic coupling between different inductors of a circuit are their increased complexity, their reduced Q factor, and the need for the inductor to be located for the reduced The fact that inductive coupling is optimal for the sweet-spot of each other
This would be a difficult task in a circuit with many different inductors, requiring a complex and thus problematic design process where many trade-offs must be made, and often EM simulations show that the total reduction in inductive coupling may be limited to about 20dB

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Embodiment Construction

[0026] Thus, the present invention in a first aspect provides a semiconductor device for canceling long-range electromagnetic crosstalk comprising an integrated circuit having more than one inductor, wherein the more than one inductor is formed in an outer layer of the integrated circuit , and wherein said more than one inductor is located substantially in the same horizontal plane of the device, further comprising a first layer capable of generating eddy currents located on a first side of the semiconductor device, and a first layer capable of generating eddy currents located on a first side of the semiconductor device A second layer on two sides, the first layer and the second layer are located on either side of the more than one inductor.

[0027] The semiconductor device may be a complex chip or integrated circuit including up to 10 or more inductors and multiple IP blocks or building blocks, such as a WLAN receiver chip (see for example figure 1 ). Typically, such device...

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Abstract

Typically, chips nowadays comprise a number of circuits as well as a number of inductors, often RF-inductors. These IC inductors are essential to realize the voltage controlled oscillators needed in the many fully integrated transceiver chips, serving a multitude of wireless communication protocols, that are provided to the market today. The present invention relates to an RF-IC packaging method, which virtually eliminates the long-range electromagnetic crosstalk between inductors and transmission lines of different parts of the circuitry.

Description

technical field [0001] The present invention relates to RF-IC packaging methods that virtually eliminate long-range electromagnetic crosstalk between inductors and transmission lines in different parts of the circuit. Background technique [0002] Typically, today's chips or integrated circuits (ICs) include multiple IP blocks (or building blocks) and multiple inductors, usually RF inductors. These IC inductors are necessary to implement the voltage-controlled oscillators required for many fully integrated transceiver chips offered to the market today for multi-wireless communication protocols. The required inductance value is typically a few nH and should preferably be adjustable to the application, however the quality factor should preferably be as high as possible. Preferably, an additional benefit may be a low net magnetic field, resulting in a low net field with other inductors ( figure 1 ) or lower magnetic coupling between interconnect lines, which is the purpose of...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/522H01F17/00
CPCH01L2924/1903H01L2924/19104H01L24/48H01L23/5227H01L2224/48463H01F2017/008H01L23/552H01L2924/01019H01L24/49H01L23/66H01L2223/6627H01L2924/19041H01L2924/19015H01L2224/49171H01L2924/30107H01L2924/3025H01L23/645H01L2924/14H01L2924/00014H01L2924/00H01L2224/45099H01L2224/45015H01L2924/207
Inventor 卢卡斯·弗雷德里克·蒂梅杰
Owner NXP BV