Method for ultrasonically measuring interface rigidity in bonding structure
A technology of interface stiffness and measurement method, which is applied in the direction of using sound waves/ultrasonic waves/infrasonic waves to analyze solids, process detection response signals, etc., and can solve problems such as inaccurate bonding stiffness
Inactive Publication Date: 2011-09-21
BEIJING UNIV OF TECH
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[0006] The purpose of this invention is to solve the current situation that the size of the interface bonding stiffness of advanced steel cannot be measured accurately and in service, evaluate the bonding health status and interface stiffness of advanced steel, and propose an ultrasonic measurement of interface stiffness of advanced steel bonding method
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[0039] The content of the present invention will be further described in detail below in conjunction with specific embodiments:
[0040] For the device used in the present invention, see figure 1 , Including: advanced steel-adhesive-advanced steel 1, self-excited and self-receiving sensor 2, power amplifier 3, function generator 4, oscilloscope 5 and computer 6. Among them, the sensor 2 is installed on the adhesive structure 1, the sensor 2 is connected to the power amplifier 3, the power amplifier 3 is connected to the function generator 4, the function generator 4 is connected to the oscilloscope 5, and the oscilloscope 5 is connected to the computer 6.
[0041] The present invention uses ultrasonic waves to measure the interface stiffness coefficient of the bonding structure, and the steps are as follows:
[0042] 1) In this example, based on the bonding structure composed of steel-epoxy-steel, the density is ρ 1 =7800kg / m 3 , The longitudinal wave velocity is c 1L =5850m / s, the t...
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Abstract
The invention relates to a method for ultrasonically measuring the interface rigidity in a bonding structure, which belongs to the technical field of nondestructive testing. The method comprises the following steps of: determining a reflection coefficient by utilizing the reflection echo of the bonding interface; determining the rigidity coefficients of the bonding structure in a debonding area, a weakly bonding area and an ideal bonding area jointly by utilizing the reflection coefficient and resonant frequency; selecting the resonant frequency through the characteristics of multiple times of reflection echoes of the bonding interface; utilizing the resonant frequency as the central frequency of detecting advanced steel materials, an adhesive and the advanced steel materials; obtaining the reflection coefficient by making full use of the reflection echoes of the interface so as to obtain the rigidity coefficient of the interface, wherein under the resonant frequency, an ultrasonic echo signal changes continuously along with the change of the rigidity of the bonding interface, and the error of the rigidity through the ultrasonic measurement is less than 5 percent. The method solves the problem that the rigidity coefficient of the interface cannot be measured rapidly, accurately and in service.
Description
Technical field [0001] The invention belongs to the field of non-destructive testing, and specifically relates to an ultrasonic measuring method for the interface stiffness of a bonding structure. Background technique [0002] The bonding structure is widely used and researched in many fields such as aviation, aerospace, military industry and machinery. The debonding of the bonding layer and the decrease of the interface strength during use are important factors affecting the bonding structure. It is also the field of non-destructive testing. One of the important factors for testing and evaluating the bonding quality of the bonding interface. [0003] The ultrasonic method cannot directly measure the bonding strength, and it is more difficult to measure the weak bonding strength, but the stiffness coefficient, thickness, attenuation, etc. of the adhesive layer can be measured, and these quantities can indirectly reflect the average bonding interface under certain conditions Intens...
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IPC IPC(8): G01N29/12G01N29/44
Inventor 吴斌邱兆国何存富
Owner BEIJING UNIV OF TECH