Ultrasonic wave measurement method for interface bonding stress in bonding structure
A measurement method and interface bonding technology, applied in the direction of measuring devices, instruments, mechanical devices, etc., can solve the problem of inaccurate bonding interface stress and other problems
Inactive Publication Date: 2011-06-08
BEIJING UNIV OF TECH
View PDF4 Cites 12 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0006] The purpose of the present invention is to solve the current situation that the magnitude of the interface stress of the advanced steel material interface cannot be measured accurately and in service, to evaluate the bonding health status and interface bonding stress of the advanced steel material, and to propose a method for interfacial bonding in the bonding structure. Ultrasonic Measuring Method of Joint Stress
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0042] Below in conjunction with specific embodiment, content of the present invention is described in further detail:
[0043] The device that the present invention adopts sees figure 1, including: advanced steel-adhesive-advanced steel bonded structure 1, self-exciting self-receiving sensor 2, power amplifier 3, function generator 4, oscilloscope 5 and computer 6. Wherein, the sensor 2 is installed on the adhesive structure 1, the sensor 2 is connected with the power amplifier 3, the power amplifier 3 is connected with the function generator 4, the function generator 4 is connected with the oscilloscope 5, and the oscilloscope 5 is connected with the computer 6.
[0044] The present invention utilizes ultrasonic waves to measure the interface bonding stress of the bonding structure, and the steps are as follows:
[0045] 1) In this example, the bonding structure composed of steel-epoxy resin-steel is used as the basis, and the density is ρ 1 =7800kg / m 3 , the longitudinal...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| density | aaaaa | aaaaa |
| density | aaaaa | aaaaa |
Login to View More
Abstract
The invention relates to an ultrasonic wave measurement method for interface bonding stress in a bonding structure and belongs to the technical field of non-destructive testing. A reflection coefficient is determined by using a reflection echo of a bonding interface and the interface bonding stress of the bonding structure in an ideal bonding area is determined by using both the reflection coefficient and a resonant frequency. The resonant frequency is selected according to the characteristics of multiple-reflection echoes of the bonding interface and is used as a centre frequency for detecting advanced steel, adhesive and advanced steel. Under the resonant frequency, an ultrasonic echo signal of the bonding interface continuously changes along with the change of rigidity, and the reflection coefficient is obtained by fully using the reflection echo of an interface, so that the bonding stress of the interface is obtained. The current condition that the magnitude of the interface bonding stress cannot be quickly and accurately measured on line is solved.
Description
technical field [0001] The invention belongs to the field of non-destructive testing, and in particular relates to an ultrasonic measurement method for interface bonding stress in a bonding structure. Background technique [0002] Adhesive structure is developed to meet the needs of aerospace, military and other high-tech fields. It is often used as a force-bearing structure or heat insulation, and has become a key material for rockets, satellites and space shuttles. However, the stability and safety of these parts are greatly threatened due to the difference in the bonding quality of the bonding structure interface or the existence of bonding defects. If the hazards of defects are accurately identified and judged, disasters can be largely avoided. Therefore, it is particularly important to study and solve the problem of detection and identification of the quality of this bonding interface. [0003] The use of bonded structures in machinery is also increasing, and convent...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): G01N19/04
Inventor 吴斌邱兆国何存富
Owner BEIJING UNIV OF TECH