Method for manufacturing printed circuit board and printed circuit board

Abstract

The invention discloses a method for manufacturing a printed circuit board and the printed circuit board. The method comprises the following steps of: filling a resin material into a metallization hole of a first sub board and a metallization hole of a second sub board respectively to form depth controlled plug holes; filling conductive slurry at an opening of a bonding device sandwiched between the first sub board and the second sub board, wherein a hole disc of the metallization hole of the first sub board is electrically connected with a hole disc of the metallization hole of the second sub board through the conductive slurry; and pressing the first sub board, the bonding device and the second sub board to form the printed circuit board. According to the method, the depth controlled plug holes in the metallization holes of the first sub board and the second sub board block the conductive slurry from flowing into the metallization holes so that the depths and diameters of the metallization holes are protected and the metallization holes can realize plug of devices.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of circuits, and in particular to a method for manufacturing a printed circuit board and the printed circuit board. Background technique [0002] As the functions of electronic products become more and more powerful, the large size, board thickness, and through-hole plating capabilities have reached the limit of equipment capabilities, making it difficult to improve the processing technology of multilayer printed circuit boards (PCB). The conventional processing technology of multi-layer PCB has brought great challenges. [0003] In the process of implementing the present invention, the inventor found that in order to solve the limitations of board thickness and through-hole plating ability on the production of multi-layer PCBs, the prior art fills the plating through holes (PTH) of the sub-board In fact, to prevent the conductive paste from flowing into the PTH hole to affect the ...

AI Technical Summary

Problems solved by technology

[0003] The inventor found in the process of implementing the present invention that: in order to solve the limitations of board thickness, through-hole plating ability and other issues on the production of multi-layer PCB, the prior art uses the The Plating Through Hole (PTH) of the sub-board is filled to prevent the conductive paste from flowing into the PTH hole and affect the hole diameter and hole depth. This implementation is mainly used for high-density surface mount devices such as modules and carrier boards. In the case of miniaturization, plug-in devices cannot be realized

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