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Sticking and mounting system of electronic component and control method thereof

A technology for electronic components and placement systems, applied in the field of electronic component placement systems and their control, can solve the problems of high requirements, long time, cumbersome operation process, etc., and achieve simplification of software installation, time reduction, automatic and effective Effects of Software Upgrade Jobs

Inactive Publication Date: 2014-04-09
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This takes a lot of time, and the operation process is also very cumbersome, and has high requirements for software installers and operators

Method used

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  • Sticking and mounting system of electronic component and control method thereof
  • Sticking and mounting system of electronic component and control method thereof
  • Sticking and mounting system of electronic component and control method thereof

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Embodiment Construction

[0014] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Here, in the description of the drawings, the same reference numerals are assigned to the same elements, and overlapping descriptions are omitted.

[0015] First, the configuration of the electronic component placement system 1 will be described.

[0016] figure 1 and figure 2 It is a perspective view showing the configuration of the electronic component placement system 1 . Such as figure 1 As shown, the electronic component placement system 1 includes a placement line 2 and a host control device 3 connected to the placement line 2 through a network. The electronic component mounting system 1 mounts various electronic components on the substrate 4 under software control. but, figure 1 Only the case where the electronic component mounting system 1 has one mounting line 2 is shown, and the electronic component mounting system 1 may h...

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Abstract

The invention relates to a sticking and mounting system (1) of an electronic component, which comprises a sticking and mounting production line (2) and an upper control device (3) connected with the sticking and mounting production line (2). The control method of the sticking and mounting system (1) of the electronic component comprises the following procedures of: a basal plate supply procedure (S101), an identification procedure (S102), an upgrade instruction output procedure (S103), an upgrade software installation procedure (S104), a sticking and mounting procedure (S105), a confirmation procedure (S106) and a production starting procedure (S107).

Description

technical field [0001] The invention relates to an electronic component placement system and a control method thereof. Background technique [0002] In the SMT circuit board production (SMT) industry, the placement speed of the placement machine and the placement efficiency of the entire production line have reached a fairly fast level. However, when there is a problem with the software and it is necessary to upgrade the software, the entire production line must be stopped, the software is upgraded, and then manually debugged. After the debugging is completed, production can begin. According to the software upgrade method of the chip mounter as described in Patent Document 1, the engineer inserts a floppy disk or USB disk with the upgrade software into the chip mounter, and then manually performs a series of installation operations such as software upgrade. After the software is upgraded, the operator needs to manually operate the machine to perform steps such as placement ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/50G05B19/418
CPCY02P90/02
Inventor 吕方武东雅之
Owner PANASONIC CORP