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Circuit board interconnecting device

A technology for interconnection devices and circuit boards, which is applied in the field of communication, can solve problems that affect assembly consistency and increase costs, and achieve the effects of improving consistency, reducing costs, and avoiding welding processes

Active Publication Date: 2010-11-03
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the process of realizing the present invention, the inventor found that there are at least the following problems in the prior art: for the arch-shaped bridge piece to realize the signal backflow communication, manual welding is required, so that Affects assembly consistency; increases cost due to additional arch bridges and welding steps

Method used

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Embodiment Construction

[0009] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0010] figure 1 A schematic structural diagram of a circuit board interconnection device provided in Embodiment 1 of the present invention, as shown in figure 1 As shown, the circuit board interconnection device of this embodiment includes a signal line 30 for signal transmission arranged between the first circuit module 10 and the second circuit...

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Abstract

The invention provides a circuit board interconnecting device which comprises a signal wire, wherein the signal wire is connected with circuit board modules on different printed circuit boards, a shielding device used for signal reflux is arranged adjacent to the signal wire, and the shielding device is crimped on the circuit module on the printed circuit board through a separating rib. According to the technical scheme, the shielding devices crimped on the circuit boards on different printed circuit boards are directly connected with the separating ribs on the first circuit module and the second circuit module, so the embodiment of the invention realizes the interconnection of the signal reflux, avoids the welding procedure, improves the consistency of the assembly, and reduces the cost.

Description

technical field [0001] Embodiments of the present invention relate to the field of communication technologies, and in particular, to a circuit board interconnection device. Background technique [0002] Due to different heat dissipation methods, assembly processes, installation sequences, and electrical performance characteristics of circuit modules, different circuit modules cannot be designed on the same printed circuit board (PCB for short). If the circuit signals of the circuit modules not on the same board need to be connected, they can be interconnected to realize the connection of the circuit signals. Generally speaking, in the prior art, arched bridges are used to interconnect circuit modules that are not on the same board, so as to realize communication of signal transmission and signal return. [0003] In the process of realizing the present invention, the inventor found that there are at least the following problems in the prior art: for the arched bridges that r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K9/00
Inventor 熊献智李宣宏田丹
Owner HUAWEI TECH CO LTD
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