Locating and guiding water spray device for linear cutting machine

Abstract

A locating and guiding water spray device for a linear cutting machine relates to the field of a device for locating, guiding and spraying water to a processed work-piece. A guider (6) is installed in a thread installation hole (21) in the guider of a water spray plate (2) of the locating and guiding water spray device (1); a locator (7) is installed in the guider (6); an airtight annular plane (9) of a flow stabilizer (8) is compacted on a bound annular plane (22) of the flow stabilizer of the water spray plate (2); an external thread connection ring (11) of the water spray plate of the guider (6), a hexangular plate hand block (10) and an outwards-projected cone frustum of a locator installation hole (12) form an integrated member; some flow-stabilizing holes (14) are opened on the flowstabilizer (8); a cone head (16) is disposed on the front surface of the flow stabilizer (8), and the airtight annular plane (9) is disposed on the back surface. The locating and guiding water spray device can cause the emulsion to form a stable flow in the device; and a constant-pressure fluid can efficiently decrease the temperature and remove chips.

Description

Technical field: [0001] The invention relates to a positioning and guiding water spraying device for a wire cutting machine tool, which relates to the field of positioning and guiding water spraying devices for cooling and chip removal of workpieces to be processed on a wire cutting machine tool. Background technique: [0002] In the past, on wire cutting machine tools, the emulsion was directly sprayed from the water pipe joint through the water spray plate to the electrode wire running in the workpiece to cool and remove chips. The disadvantage is that the pressure of the emulsion liquid is not concentrated, and the splash formed by the emulsion is serious. , which reduces the effect of cooling and chip removal on the electrode wire. If the emulsion can be sprayed stably to the processing surface of the electrode wire on the workpiece for effective cooling and chip removal, the water spray device structure of the water spray plate should be Make a new design. Invention c...

AI Technical Summary

Problems solved by technology

[0002] In the past, on wire cutting machine tools, the emulsion was directly sprayed from the water pipe joint through the water spray plate to the electrode wire running in the workpiece to cool and remove chips. The disadvantage is that the pressure of the emulsion liquid is not concentrated, and the splash formed by the emulsion is serious. , which reduces the effect of cooling and chip removal on the electrode wire. If the emulsion can be sprayed stably to the processing surface of the electrode wire on the workpiece for effective cooling and chip removal, the water spray device structure of the water spray plate should be make a new design

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