Film forming system and film forming method
A film-forming device and a film-forming method technology, applied in spraying devices, liquid spraying devices, devices for coating liquid on surfaces, etc., can solve the problems of easy contamination of coating nozzles, increased deviation of film thickness, and uniformity of film thickness Reduce the problem of reducing and other problems, achieve the effect of improving the operation rate, improving the utilization efficiency of materials, and preventing the reduction of the uniformity of film thickness
Active Publication Date: 2015-04-22
KK TOSHIBA
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Problems solved by technology
However, in this method, since the coating is performed on a spiral trajectory, and the coating nozzle moves along the spiral trajectory in a state close to the substrate, the coating nozzle is easily contaminated compared with the spin coating method. Due to this contamination, the variation in film thickness increases, so the uniformity of film thickness decreases
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Embodiment Construction
[0024] One embodiment of the present invention will be described with reference to the drawings.
[0025] Such as figure 1 As shown, a film forming apparatus 1 according to an embodiment of the present invention includes a stage 2 on which a wafer W as an object to be coated is placed, a rotation mechanism 3 that rotates the stage 2 in a horizontal plane, and feeds the material from the front end to the stage. The wafer W on the frame 2 is discharged, the coating nozzle 4 for coating, the moving mechanism 5 that moves the coating nozzle 4 and the stage 2 relatively in the horizontal plane direction, and the image of the coating nozzle 4 in the process of discharging the material is acquired The image acquisition part 6, the cleaning device 7 that cleans the coating nozzle 4, the inspection device 8 that checks the contamination of the coating nozzle 4, the observation device 9 that observes the film surface of the coating film M on the wafer W, and each part The control part ...
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According to one embodiment, a film forming system includes: a stage including a placement surface on which an object to be coated is placed; a rotating mechanism rotating the stage in a rotational direction along the placement surface; an application nozzle discharging a material onto the object placed on the stage for application; a moving mechanism relatively moving the stage and the application nozzle along the placement surface in a cross direction crossing the rotational direction; a controller performing a control to rotate the stage on which the object is placed through the rotating mechanism while relatively moving the stage and application nozzle along the placement surface in the cross direction through the moving mechanism and applying the material to the object on the stage through the application nozzle; and a cleaning apparatus cleaning the application nozzle.
Description
technical field [0001] The present invention relates to a film forming device and a film forming method, for example, relates to a film forming device and a film forming method for coating a material on an object to be coated and forming a coating film. Background technique [0002] In the field of semiconductors and the like, when forming a circular film on a disc-shaped substrate, it is required to make the film thickness deviation within 0.1 to 1.0 μm. In order to achieve this target range, the film is formed by the spin coating method. . In this spin coating method, a disc-shaped substrate is fixed on a circular rotating stand, and after a necessary amount of material is applied to the center of the substrate, the rotating stand is rotated at a high speed, and the rotating stand is placed on the rotating stand by centrifugal force. A method in which a material is spread over the entire surface of a substrate to form a film. [0003] In this case, the material usage eff...
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IPC IPC(8): B05B13/04B05B15/02B05B9/04B05D1/02B05D1/40H01L21/00
CPCB41J2/165B05C5/0291B05B15/0266B05C11/08B05D1/005H01L21/67051B05C5/0216B41J2/16579B05B12/08B05B15/025H01L21/6715B05B12/084B05B15/555B05B15/557B05B15/52B05B15/55B05D1/40H01L21/0274
Inventor 大城健一佐藤强德本隆男夏贞雄岩崎聪一郎
Owner KK TOSHIBA