Scrap-bouncing preventing method for press tool
A technology of stamping die and processing method, applied in the field of anti-chipping treatment of stamping die, can solve the problems of shortening the life of die parts, mold core expansion and cracking, and difficulty in determining size parameters, so as to reduce product manufacturing costs and reduce mold Processing costs and the effect of enhancing market competitiveness
Active Publication Date: 2010-12-08
SHANGHAI LAIMU ELECTRONICS
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Problems solved by technology
② It is difficult to control the amount of cladding brazing, relying on the experience of technicians to work
③The coated brazing is easy to hit the edge of the punch, which affects the sharpness of the edge of the punch and reduces the life of the mold parts
Prove the effect in production: chip jumping can be improved to a certain extent, but at the same time, some new problems will arise
If the size is too large, it is easy to cause waste chips to be stuck in the core of the knife edge, causing the core to swell or break the punch
②It is inconvenient for daily maintenance after the bottom of the punch edge is processed into a special shape
②It will increase production equipment and production cost
The verification effect in production: ①It is only suitable for the blanking punch with a large area, and the punch with a small area cannot be used
②Increased parts processing cost
[0007] From the analysis of the above status quo, it can be seen that the current methods to solve die chip jumping have limitations, and cannot be standardized and generalized. No increase (or a small increase in cost) to achieve the purpose of anti-chip, and there are theoretical design parameters for processing basis, so as to achieve standardization and generalization
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[0026] see figure 1 , 2 , which is a structural schematic diagram of the mold core used in Example 1 of the anti-chip chip treatment method of the stamping die of the present invention. As shown in the figure: the shape of the knife-edge of the punch 1 is circular or oval, and the mold core of the knife-edge needs to be split, and the S-shaped groove 21 is processed on the inner wall of the mold core 2, which requires secondary processing to complete.
[0027] In the above-mentioned embodiment 1, the material thickness T<0.3mm, the groove width W=0.5mm, the depth H=8%T, and the inclination angle α=5°.
[0028] see again Figure 3-6 , which is a structural schematic diagram of the die used in Embodiment 2 of the anti-chip chip treatment method of the stamping die of the present invention. As shown in the figure: when the shape of the knife edge is polygonal, the chute A1, B1 is processed on the inner wall of the straight edge knife edge die A, B. The chute and the shape of ...
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The invention relates to a pressing and producing method for an accurate press tool in electronic industries, in particular to a scrap-bouncing preventing method for a press tool. The scrap bouncing preventing method for a press tool solves the problem of scrap bouncing by utilizing the tolerance range of blanking clearances and processing a slant groove on the inner wall of a cut mold. The invention has the advantages of directly improving product quality and production efficiency and reducing the manufacture cost of press products.
Description
technical field [0001] The invention relates to a stamping production method of a precision stamping die in the electronics industry, in particular to a method for preventing chipping of the stamping die. Background technique [0002] At present, the molds of metal parts of electronic products all have punching wastes of regular shapes such as round holes and rectangles. When the mold is in high-speed stamping production, after the waste material is sheared, it should have stayed in the cutting edge of the lower die to get stuck or fall. However, when the shape of the punching waste is simple, there is often a phenomenon that the waste left in the die core of the knife edge will jump up and fall on the die surface, which is called chip skipping. Chip jumping will cause waste chips in the mold and the product to fall and be squeezed to damage the product and the mold, which is not conducive to the control of product quality and production cost during mass production. At thi...
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IPC IPC(8): B21D28/14
Inventor 朱新爱丁秀兵
Owner SHANGHAI LAIMU ELECTRONICS