Ceramic insulating film heat-conducting substrate and manufacturing method thereof

Abstract

The invention relates to the technical fields of electronics and photoelectronic packaging, and discloses a ceramic insulating film heat-conducting substrate and a manufacturing method thereof. The surface of a metal substrate is cleaned and roughened, so the surface of the metal substrate becomes a concave-convex clean surface; a layer of ceramic insulating film is sprayed on the surface of the metal substrate by a plasma spraying or ultrasonic spraying method; and a metal electrode layer required is printed on the polished surface of the ceramic insulating film by a screen printing process. The method has the advantages of simple process, low manufacturing cost, good radiating effect and no micropore conduction.

Description

technical field [0001] The invention relates to the technical field of electronic and optoelectronic packaging, in particular to a ceramic insulating film heat-conducting substrate and a manufacturing method thereof. Background technique [0002] Since the rise of the junction temperature during LED operation will reduce the probability of luminous recombination, the lifespan and output luminous flux will also decrease with the increase of temperature. If the heat generated by the PN junction can be dissipated as soon as possible, it will not only improve the luminous efficiency of the product, but also improve the reliability and life of the product. LED chips also have strict requirements on the matching of the linear expansion coefficient of the substrate material. [0003] At present, the more common ceramic substrates on the market are mostly LTCC (Low Temperature Co-fired Ceramic LTCC) or ceramic heat dissipation substrates made of thick film technology. Due to the dif...

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Problems solved by technology

Main problems: 1. The film layer is restricted by the base material and is difficult to control; 2. The process is complicated and takes a long time; 3. The insulating medium layer that does not require the insulating medium layer affects the heat dissipation effect of the substrate; 4. There will be micro-hole conduction , the sealing agent will further reduce the thermal conductivity

[0005] Stainless steel-based metal PCB substrate, the insulating medium layer is a mixture of glass and ceramics, and the metal circuit layer is made of a thick film process; the main problems: 1. Need to use glass as an adhesive, and the thermal conductivity of glass is poor; 2. Available for selection The metal substrate is only stainless steel, and the thermal conductivity of stainless steel is low, which is not conducive to heat dissipation; 3. The sintering process is adopted, the process is complicated, the time is long, and the energy consumption is high

[0006] Epoxy resin packaging method, due to the low thermal conductivity of epoxy resin (0.3W / m·K), the overall heat dissipation effect will be seriously affected, reducing the life of the LED

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