Unmatched seal stress release structure
A stress release and sealing tube technology, applied in microstructure technology, microstructure devices, measuring devices, etc., can solve the problems of large packaging structure, high packaging cost, reducing the vacuum degree and life of devices, etc., and achieve low packaging cost, The effect of improving thermal fatigue resistance and increasing reliability
Active Publication Date: 2012-11-28
WUXI ZHONGWEI GAOKE ELECTRONICS +1
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Problems solved by technology
[0003] However, the packaging structure of the above-mentioned infrared MEMS chip still has the following problems: when the infrared MEMS chip is vacuum-packaged, a certain flexible organic adhesive will be used, and the organic adhesive will reduce the vacuum degree and life of the device, and The packaging structure is bulky and the packaging cost is high
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[0014] The present invention will be further described below in conjunction with specific drawings and embodiments.
[0015] Such as Figure 1~Figure 3 As shown: the present invention includes a chip welding area 1, a shell brazing area 2, a stress release area 3, a housing 4, a first positioning groove 5, a window 6, an infrared MEMS chip 7, an installation step 8, a sealing tube 9, and a connection port 10. The second positioning groove 11 , the sealing support ring 13 and the through hole 14 .
[0016] Such as figure 1 and figure 2 Shown: is a structural schematic diagram of the sealing support ring 13 of the present invention. The sealing support ring 13 includes a chip bonding area 1 located on the inner ring and a shell brazing area 2 located on the outer ring of the chip bonding area 1, and a stress relief is provided between the shell brazing area 2 and the chip bonding area 1 District 3. The stress relief area is composed of a plurality of stress relief blocks u...
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The invention relates to an unmatched seal stress release structure which comprises a seal support ring, wherein the seal support ring comprises a chip welding area positioned in an inner ring and a shell brazing area which is positioned at the outer ring of the chip welding area; and the shell brazing area is connected with the chip welding area by a stress release area. The seal support ring ofthe invention comprises the chip welding area, the shell brazing area and the stress release area; the shell brazing area is welded and fixed on an installation step; the chip welding area is used for installing and fixing an infrared MEMS (Micro Electro Mechanical System) chip, and the infrared MEMS chip is positioned in a vacuum environment; when the ambient temperature is changed, the infraredMEMS chip and the chip welding area generate stress, the stress accumulated on the infrared MEMS chip due to ambient temperature change can be released by the stress release area, thus, the infrared MEMS chip is not deformed; therefore, the invention improves the heat fatigability, vacuum degree, service life and reliability of the infrared MEMS chip and has convenient installation and use, smallseal size and low seal cost.
Description
technical field [0001] The invention relates to a MEMS chip mismatch packaging structure, in particular to a mismatch sealing stress release structure, which belongs to the technical field of microelectronic packaging. Background technique [0002] Currently, MEMS chips have various packaging structures. Taking infrared MEMS chip packaging as an example, when the temperature changes, stress will be generated due to the difference in thermal expansion coefficient between the MEMS chip and the chip support structure, forming a mismatched packaging structure, and the stress will distort the image of the infrared MEMS chip. At present, in order to reduce the influence of temperature changes on the stress of infrared MEMS chips, it is mainly by vacuuming the MEMS (Micro-Electro-Mechanical Systems) devices, using organic adhesives to bond and keeping the device at a constant temperature to reduce the stress on the chip. Influence of infrared MEMS device performance. [0003] Ho...
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IPC IPC(8): B81B7/00
Inventor 丁荣峥张顺亮唐桃扣
Owner WUXI ZHONGWEI GAOKE ELECTRONICS