Conductive ink and preparation method thereof

A technology of conductive ink and acrylic resin, which is applied in the field of copper-doped conductive ink and its preparation, can solve the problems of reducing the conductivity of slurry and other physical properties, poor anti-aging, and affecting product performance, achieving long-lasting performance, It is not easy to oxidize and does not affect the quality of the effect

Inactive Publication Date: 2011-01-05
IRICO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Copper is a very good conductor, its resistivity is close to that of silver, and the price of copper powder is low. Direct mixing of copper powder can reduce the cost, bu

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0024] Example 1

[0025] The preparation of conductive ink is specifically:

[0026] 1) In terms of parts by mass, mix 65 parts of 1,4-butyrolactone with 35 parts of vinyl acetate resin, and stir (500 rpm) for 5 hours in a 70°C water bath to dissolve the vinyl acetate resin , Get the organic carrier A;

[0027] Mix 65 parts of diethyl adipate and 35 parts of epoxy acrylic resin, and place them in a 70°C water bath and stir (500 revolutions / min) for 5 hours to dissolve the epoxy acrylic resin to obtain an organic carrier B;

[0028] 2) Weigh according to the following mass parts:

[0029] 50 parts of flake silver powder with an average particle size of 5-20 microns;

[0030] 6 parts of silver-coated copper powder with spherical shape and average particle size not exceeding 5 microns, in which the mass ratio of silver to copper is 1:5;

[0031] 40 parts of organic carrier A;

[0032] 3.85 parts of organic carrier B;

[0033] 0.15 parts of KH-550 as coupling agent;

[0034] According to the a...

Example Embodiment

[0035] Example 2

[0036] The preparation of conductive ink is specifically:

[0037] 1) In parts by mass, mix 60 parts of isophorone with 40 parts of chloroacetate resin, and place in a water bath at 100°C and stir (600 rpm) for 2 hours to dissolve the chloroacetate resin to obtain organic Carrier A;

[0038] Mix 65 parts of diethyl adipate with 35 parts of thermosetting acrylic resin, and stir (600 rpm) for 2 hours in a 100°C water bath to dissolve the thermosetting acrylic resin to obtain an organic carrier B;

[0039] 2) Weigh according to the following mass parts:

[0040] 40 parts of flake silver powder with an average particle size of 5-20 microns;

[0041] 10 parts of spherical silver-coated copper powder with an average particle size not exceeding 5 microns; the mass ratio of silver to copper is 1:10;

[0042] 45 parts of organic carrier A;

[0043] 4.85 copies of organic carrier B;

[0044] 0.15 parts of KH-550 as coupling agent;

[0045] According to the above mass ratio, fully m...

Example Embodiment

[0046] Example 3

[0047] The preparation of conductive ink is specifically:

[0048] 1) In terms of parts by mass, mix 65 parts of 1,4-butyrolactone with 35 parts of vinyl acetate resin, and stir (800 rpm) for 3 hours in a water bath at 80°C to dissolve the vinyl acetate resin , Get the organic carrier A;

[0049] Mix 75 parts of ethylene glycol butyl ether acetate with 25 parts of epoxy acrylic resin, and place it in a water bath at 80° C. and stir (800 rpm) for 3 hours to dissolve the epoxy acrylic resin to obtain an organic carrier B;

[0050] 2) Weigh according to the following mass parts:

[0051] 55 parts of flake silver powder with an average particle size of 5-20 microns;

[0052] 5 parts of silver-coated copper powder with spherical shape and average particle size not exceeding 5 microns; the mass ratio of silver to copper is 1:8;

[0053] 35 parts of organic carrier A;

[0054] Organic Carrier B 4.9 parts;

[0055] 0.1 part of KH-550 as coupling agent;

[0056] According to the a...

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PUM

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Abstract

The invention discloses conductive ink and a preparation method thereof. The conductive ink comprises the following components in percentage by mass: 40 to 55 percent of flaky silver powder, 5 to 10 percent of sliver-coated copper powder, 30 to 45 percent of organic carrier A, 3 to 5 percent of organic carrier B and 0.1 to 0.2 percent of coupling agent. In the conductive ink and the preparation method thereof, the sliver-coated copper powder is added into the conductive ink of pure silver slurry, and part of sliver powder is replaced by the sliver-coated copper powder so as to reduce the cost of the conductive ink. The sliver-coated metal powder is formed by plating a layer of sliver outside the copper powder, so the sliver-coated metal powder is difficult to oxidize, has high ageing resistance and achieves the effects of reducing the cost and not influencing quality.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to conductive ink used for flexible circuits, in particular to a copper-doped conductive ink and a preparation method thereof. Background technique [0002] The low-temperature conductive ink silver paste applied to flexible circuits is a viscous paste of a mechanical mixture composed of high-purity (99.9%) metallic silver particles, binders, solvents, and additives. It cures at low temperature and can be used on PET, PC, PT, PVC, PU and other sheets. It is suitable for screen printing and has good printability, electrical conductivity, oxidation resistance, hardness, expansion performance and extremely strong of adhesion. It can be widely used in membrane switches, printed contacts, radio frequency interference shielding, heating elements, flexible circuits, electroplating, multilayer circuit boards, etc. It is a functional material for the manufacture of electronic ter...

Claims

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Application Information

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IPC IPC(8): C09D11/02C09D11/52
Inventor 姚函亮
Owner IRICO
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