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Cooling fin, preparation method of cooling fin, radiator and preparation method of radiator

A technology of heat dissipation fins and radiators, which can be used in indirect heat exchangers, heat exchange equipment, lighting and heating equipment, etc., and can solve problems such as enlargement

Inactive Publication Date: 2011-01-12
GOLDEN SUN NEWS TECHN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

So far, if you want to further increase the area of ​​the fins of the stacked heat sink, in addition to increasing its size to increase the area, it is nothing more than making the fins take various shapes such as waves to increase the area, but the number that can be increased is still limited. , and is often accompanied by an increase in volume, so it has reached a bottleneck

Method used

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  • Cooling fin, preparation method of cooling fin, radiator and preparation method of radiator
  • Cooling fin, preparation method of cooling fin, radiator and preparation method of radiator
  • Cooling fin, preparation method of cooling fin, radiator and preparation method of radiator

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Embodiment Construction

[0041] In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are only provided for reference and illustration, and are not used to limit the present invention.

[0042] The invention provides a large area heat dissipation fin and a manufacturing method thereof. Such as figure 1 and figure 2 Shown are the flowcharts of the method for manufacturing heat sink fins of the present invention and the appearance diagrams of the first embodiment thereof. The heat dissipation fin 1 has a fin body 10 made of a metal material with good heat dissipation, and a sheet-shaped expansion part 11 extends from the outer edge of one side of the fin body 10 to pass the expansion part 11 increases the heat dissipation area of ​​the heat dissipation fin 1, and at the same time, the amplifying portion 11 is bent and overlapped on ...

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Abstract

The invention relates to a cooling fin, a preparation method of the cooling fin, a radiator and a preparation method of the radiator. The cooling fin is formed by a metal plate and contains a fin body; the outer edge of one side of the fin body extends to form a flaky extension part; the extension part can be bent to the fin body and stacked on the fin body to form one cooling fin; and the radiator comprises a plurality of the cooling fins and a heat-conductive component, and the cooling fins can be inserted in sequence through the condensing section of the heat-conductive component to form the radiator.

Description

Technical field [0001] The present invention relates to a heat sink, in particular to a large-area heat dissipation fin that can increase the heat dissipation area of ​​a stacked heat dissipation fin and a manufacturing method thereof, and a heat sink having the heat dissipation fin and a manufacturing method thereof. Background technique [0002] According to the rapid upgrade of the computer industry, the operation speed of electronic components is increasing, and the heat generated by them also increases. Therefore, in order to maintain the electronic components to continue to operate at their permitted temperature, it is a well-known technology to use a heat sink to provide heat dissipation for the electronic heating components. Nowadays, in addition to heat pipes and other heat-conducting components that utilize vapor-liquid cyclical changes to help the radiator quickly achieve heat transfer, the radiating fins that pass through the condensing end of the heat-conducting comp...

Claims

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Application Information

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IPC IPC(8): F28F3/04F28D15/02B21D53/04B21D53/08H05K7/20
Inventor 林国仁林贞祥郑志鸿许建财
Owner GOLDEN SUN NEWS TECHN