Stress inductor and assembly method thereof

An assembly method and sensor technology, which can be applied to instruments, measuring forces, measuring devices, etc., can solve the problems of poor assembly efficiency, inconvenience, excessive thickness and weight, and improve assembly efficiency and simplify assembly. Steps, the effect of improving the bonding effect
CN101943618AInactive Publication Date: 2011-01-12ELAN MICROELECTRONICS CORPORATION

Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
ELAN MICROELECTRONICS CORPORATION
Publication Date
2011-01-12
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention relates to a stress inductor and an assembly method thereof. The stress inductor comprises a circuit substrate, a pointing actuating part and a metal back plate, wherein the circuit substrate has a stress induction structure, and the stress induction structure comprises a stress deformation area and a plurality of stress induction resistors; the pointing actuating part is arranged on the top surface of the circuit substrate and connected with the stress induction structure; and the metal back plate is provided with at least one jointing material coating area, and a plurality of fixedly connected edges of the circuit substrate are fixedly connected in the jointing material coating area. The assembly method for the stress inductor is applied to the stress inductor and comprises the following steps of: combining the pointing actuating part to the top surface of the circuit substrate; and fixedly connecting the fixedly connected edges of the circuit substrate to the at least one jointing material coating area of the metal back plate. The stress inductor has a few elements, and has the advantages of small size and low cost; and because the circuit substrate is directly fixedly connected on the metal back plate, the assembly method for the stress inductor simplifies the assembly step and promotes the assembly efficiency.
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Description

technical field

[0001] The present invention relates to an inductor and its assembly method, in particular to a stress sensor for combining with an electronic device and its assembly method. Background technique

[0002] At present, stress sensors have been gradually applied in various electronic devices as pointing devices. These electronic devices are, for example, notebook computers, mice, keyboards, handheld devices, joysticks, and the like. As a further example, the setting of stress sensors can be seen between the keys of the common notebook computer keyboards on the market. The user can use the finger to touch the stress sensor to make it sense the size and direction of the user's pulling force, so as to control the cursor on the screen and generate a corresponding displacement.

[0003] see Figure 1A and Figure 1B as shown, Figure 1A It is a three-dimensional schematic diagram of an existing conventional stress sensor. Figure 1B It is an exploded schematic di...

Claims

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