Stress inductor and assembly method thereof

An assembly method and sensor technology, which can be applied to instruments, measuring forces, measuring devices, etc., can solve the problems of poor assembly efficiency, inconvenience, excessive thickness and weight, and improve assembly efficiency and simplify assembly. Steps, the effect of improving the bonding effect

Inactive Publication Date: 2011-01-12
ELAN MICROELECTRONICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] It can be seen from the structure of the conventional stress sensor 10 that when the stress sensor 10 with multi-layer components is locked to the structure of an electronic device by a screw passing through another locking hole 163 of the holder 15 (such as the keyboard body), the overall thickness and weight will appear too thick and heavy, which does not meet the trend of light and thin electronic devices.
In addition, the existing conventional stress sensor 10 contains too many components, resulting in poor assembly efficiency, and the production cost cannot be effectively reduced.
[0006] It can be seen that the above-mentioned existing stress sensor and its assembly method obviously still have inconvenience and defects in product structure, method and use, and need to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve

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  • Stress inductor and assembly method thereof
  • Stress inductor and assembly method thereof
  • Stress inductor and assembly method thereof

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Embodiment Construction

[0055] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure and method of the stress sensor and its assembly method according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , steps, features and effects thereof are described in detail below.

[0056] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. Through the description of the specific implementation mode, a more in-depth and specific understanding of the technical means and effects adopted by the present invention to achieve the intended purpose can be obtained. However, the accompanying drawings are only for reference and description, and are not used to explain the p...

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Abstract

The invention relates to a stress inductor and an assembly method thereof. The stress inductor comprises a circuit substrate, a pointing actuating part and a metal back plate, wherein the circuit substrate has a stress induction structure, and the stress induction structure comprises a stress deformation area and a plurality of stress induction resistors; the pointing actuating part is arranged on the top surface of the circuit substrate and connected with the stress induction structure; and the metal back plate is provided with at least one jointing material coating area, and a plurality of fixedly connected edges of the circuit substrate are fixedly connected in the jointing material coating area. The assembly method for the stress inductor is applied to the stress inductor and comprises the following steps of: combining the pointing actuating part to the top surface of the circuit substrate; and fixedly connecting the fixedly connected edges of the circuit substrate to the at least one jointing material coating area of the metal back plate. The stress inductor has a few elements, and has the advantages of small size and low cost; and because the circuit substrate is directly fixedly connected on the metal back plate, the assembly method for the stress inductor simplifies the assembly step and promotes the assembly efficiency.

Description

technical field [0001] The present invention relates to an inductor and its assembly method, in particular to a stress sensor for combining with an electronic device and its assembly method. Background technique [0002] At present, stress sensors have been gradually applied in various electronic devices as pointing devices. These electronic devices are, for example, notebook computers, mice, keyboards, handheld devices, joysticks, and the like. As a further example, the setting of stress sensors can be seen between the keys of the common notebook computer keyboards on the market. The user can use the finger to touch the stress sensor to make it sense the size and direction of the user's pulling force, so as to control the cursor on the screen and generate a corresponding displacement. [0003] see Figure 1A and Figure 1B as shown, Figure 1A It is a three-dimensional schematic diagram of an existing conventional stress sensor. Figure 1B It is an exploded schematic di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/22
Inventor 林俊华唐泽文明黄俊杰黄诗郎
Owner ELAN MICROELECTRONICS CORPORATION
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