Coating device, evaporation source device and evaporation source container
A coating device and evaporation source technology, which is applied in the field of coating devices and evaporation source devices, can solve problems such as heat transfer that have not been raised, and achieve the effect of simple structure, high efficiency, and low-cost manufacturing
Inactive Publication Date: 2012-10-10
HITACHI HIGH-TECH CORP
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[0016] In contrast, in the above-mentioned prior art, for example, the above-mentioned Patent Document 4, like the above-mentioned Patent Document 3, describes that a plurality of crucibles extending in the longitudinal direction are arranged in parallel to evaporate the evaporation material at a high rate, but both There is no proposed structure for efficiently transferring heat to the evaporation material in the crucible and evaporating the evaporation material at a high rate
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[0033] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0034] First, attach figure 1 It is a cross-sectional view showing a general structure of a manufacturing device of an organic EL device, especially a device for forming a light-emitting material layer (EL layer) sandwiched between electrodes on the surface of a substrate to be vapor-deposited such as a glass plate, that is, a so-called coating device. In the figure, numeral 10 denotes a vacuum chamber, and the inside of the vacuum chamber 10 is formed to hold 10 -3 ~10 -5 The coating chamber 11 with a vacuum degree of about Pa. And, for example, after forming electrodes on its surface in other processes, the substrate 100 to be vapor-deposited is sent into the coating chamber 11 through a gate valve 12 provided in a part of the vacuum chamber 10 (in this example, the lower left part of the figure). Inside, as shown in the figure, while being loaded on the ...
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The invention relates to a coating device, an evaporation source device and an evaporation source container. A heating box (210) is disposed in the evaporation source device used in the coating device with the surface of a vapor plated substrate being coated with vapor plating material. A heater (71H) is disposed outside of the heating box, and a space is disposed in the internal heating box, anda plurality of evaporation source containers (220) are stacked and contained in a vertical direction. Each evaporation source container comprises a container (221) made from material of high heat conduction. The section of the container is approximately U-shaped, and a through hole (222) used for discharging gas is disposed at the center of the container which is formed by surrounding around the through hole. The evaporation source container also comprises an upper opening covering the container and a cover (225) made from material of high heat conduction. The gas of vapor plating material generated in the container is guided to the through hole through a gap, and is focused to a guiding part (212) disposed on top of the heating box, and is supplied to the surface of the vapor plated substrate (100) through an ejecting hole (213).
Description
technical field [0001] The present invention relates to a film coating device and an evaporation source device, in particular to a film coating device, an evaporation source device, and an evaporation source container suitable for manufacturing organic EL devices and the like. Background technique [0002] As a main method for manufacturing an organic EL device, there is a vacuum evaporation method. When manufacturing organic EL devices by this vacuum evaporation method, especially in coating devices that form a luminescent material layer (EL layer) sandwiched by electrodes on the surface of a substrate to be evaporated, such as a glass plate, a vacuum chamber is widely used. A coating device that vaporizes gaseous (or steam) EL material that is disposed at a position opposite to the vapor-deposited substrate, moves its positions relative to each other, and is heated and vaporized on the surface of the substrate. [0003] For example, the following Patent Document 1 disclos...
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IPC IPC(8): C23C14/24
CPCC23C14/24C23C14/243C23C14/12C23C14/54C23C14/564
Inventor 松浦宏育土井秀明加藤升韭泽信广
Owner HITACHI HIGH-TECH CORP