Packaging structure of microphone of micro electromechanical system and packaging method thereof
A micro-electromechanical system and packaging structure technology, applied in the field of microphones, can solve the problems of portable electronic devices that are not suitable for heat dissipation performance, and the heat of the microphone chip cannot be effectively dissipated, and achieve good heat dissipation performance
Inactive Publication Date: 2011-01-26
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology
However, since the colloid is used for packaging, the heat generated by the microphone chip cannot be dissipated effectively, so it is not suitable for portable electronic devices that require high heat dissipation performance.
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[0010] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0011] see figure 1 , an embodiment of the present invention provides a package structure 100 of a MEMS microphone. The packaging structure 100 of the MEMS microphone includes an upper substrate 110, a lower substrate 120 opposite to the upper substrate 110, a microphone chip 130 and a detection circuit 140 electrically connected to the microphone chip 130 (the connection path is not shown in the figure) . There is a certain gap between the upper substrate 110 and the lower substrate 120 .
[0012] The upper substrate 110 has a first surface 112 and a second surface 114 opposite to the first surface 112 . The upper substrate 110 has a plurality of first through holes 116 and a plurality of second through holes 115 . The plurality of second through holes 115 penetrate through the upper substrate 110 . The plurality of second through hol...
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The invention provides a packaging structure of a microphone of a micro electromechanical system (MEMS), which comprises an upper substrate, a lower substrate opposite to the upper substrate, and a microphone chip, wherein, space is reserved between the upper substrate and the lower substrate; the microphone chip is arranged on the surface of the lower substrate opposite to the upper substrate; the lower substrate is provided with a through hole; when an acoustic wave passes through the microphone chip via the through hole of the lower substrate, the microphone chip transforms acoustic energy into electric energy and transmits an electrical signal to a detection circuit; the upper substrate is provided with a plurality of first through holes, and a conducting material is filled in each first through hole; the lower substrate is provided with a plurality of electric connection points; and the conducting material in each first through hole of the upper substrate is electrically connected with the corresponding electric connection points of the lower substrate. The invention further provides a packaging method of the packaging structure of the microphone of the MEMS.
Description
technical field [0001] The present invention relates to a microphone, in particular to a packaging structure and a packaging method of a micro-electromechanical system (Micro Electromechanical System, MEMS) microphone. Background technique [0002] With the continuous advancement of science and technology, the application of microphones is becoming more and more extensive, especially the rapid development of MEMS microphones. Due to their good performance and easy mass production, MEMS microphones are expected to gradually be used in mobile communications, multimedia systems, and consumer electronics. It can replace the traditional electret condenser microphone (Electret Condenser Microphone, ECM) in terms of sex electronics and hearing aids. [0003] The packaging technology of the MEMS microphone directly affects the cost and quality of the entire MEMS microphone. The currently commonly used packaging method for MEMS microphones is to place the microphone chip on a silico...
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IPC IPC(8): H04R19/04B81B7/00B81C3/00
CPCH04R19/005H04R19/04H04R31/006
Inventor 张仁淙
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD