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Crystal curing press head applied to electronic tag back-off encapsulation equipment

A technology for packaging equipment and electronic labels, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc. It can solve the problems of uneven pressure of the indenter, high chip pressure, and insufficient chip pressure, etc., and achieve a good hot-pressing die-bonding effect Effect

Inactive Publication Date: 2012-07-18
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the individual differences of the individual cylinders of multiple indenters, the pressure of each indenter is uneven, resulting in hot pressing of multiple chips. Some chips have insufficient pressure, and some chips have too much pressure to cause failure or cracks. Therefore, it is necessary to adjust the pressure of each chip. The pressure of the indenter makes it even and consistent

Method used

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  • Crystal curing press head applied to electronic tag back-off encapsulation equipment
  • Crystal curing press head applied to electronic tag back-off encapsulation equipment
  • Crystal curing press head applied to electronic tag back-off encapsulation equipment

Examples

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Embodiment Construction

[0022] Such as figure 1 , 2 As shown, the die-bonding indenter applied to the electronic label upside-down packaging equipment of the present invention includes a low-friction cylinder 21, a connecting assembly, a spring 34, an adjustment ring 33, and a heating block 45; the cylinder body of the low-friction cylinder 21 passes through The connection assembly is connected with the upper thermal head template 2, and the upper thermal head template 2 is fixed on the upper pressure head connecting plate 3; the spring 34 is installed on the adjustment ring 33, and the adjustment ring 33 and the spring 34 are set on the piston rod 24, and The upper end of the adjustment ring 33 is threadedly connected with the lower end of the cylinder body; the heating block 45 is connected with the lower end of the piston rod 24 .

[0023] The present invention also includes a lower locking nut 32, a connecting piece 30, and a thermal insulation and heat dissipation device. The cylinder block of...

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PUM

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Abstract

The invention relates to a crystal curing press head applied to electronic tag back-off encapsulation equipment, which comprises a low-friction cylinder, a connection assembly, a spring, an adjusting ring and a heating block, wherein a cylinder body of the low-friction cylinder is connected with an upper hot-press head template through the connection assembly; the spring is arranged on the adjusting ring; the adjusting ring and the spring are sleeved on a piston rod, and the upper end of the adjusting ring is in threaded connection with the lower end of the cylinder body; and the heating block is connected with the lower end of the piston rod. In the crystal curing press head, the spring thrust is changed by rotating the adjusting ring to perform fine adjustment according the required pressure, and the fine adjustment pressure is detected by a high-precision push-pull force gauge, so that the pressure of a plurality of press heads is uniform, good hot-press crystal curing effect is achieved, and chips can be fixed effectively.

Description

technical field [0001] The invention relates to an electronic label upside-down packaging device, in particular to a die-bonding indenter applied to the electronic label upside-down packaging device, which can realize good thermal bonding of a chip and an antenna. Background technique [0002] The die-bonding head is applied to the electronic label equipment, and heats and presses the chip in the previous bonding process to effectively fix the chip and realize electrical conduction. [0003] The currently used die bonding head includes a low-friction cylinder and a heating block connected to the cylinder piston. The cylinder body of the low-friction cylinder is fixedly connected with the upper thermal head template through the connection assembly, and the upper thermal head template is fixed on the upper thermal head connecting plate. The air pressure inside the cylinder block acts on the piston, and the pressure is transmitted to the heating block through the piston rod, a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B25B27/00H01L21/50
Inventor 邴玉霞刘立峰郭晓光刘亚忠田学光
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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