Method for removing semi-metalized hole flash by back drilling
A semi-metal and hole position technology, applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problems of pulling the metal layer and affecting the product yield rate, and achieve the effect of improving the product yield rate
Active Publication Date: 2012-02-29
江西红板科技股份有限公司
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Problems solved by technology
At present, many circuit boards need some semi-metallized holes and U-shaped metallized holes. When processing such semi-metallized holes, due to the rotation of the milling machine spindle, peaks are likely to occur near the side of the knife, and more seriously, the half-metallized holes will be pulled off. The metal layer in the hole, which affects the yield of the product
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[0021] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.
[0022] Such as figure 1 Shown, the present invention provides a kind of method of backdrilling and removing half-metallized hole covering peak, and it comprises the steps:
[0023] Step 1, a PCB board 10 is provided, and the front side of the PCB board 10 includes several metallized holes to be cut hole positions 12 ( figure 2 shown).
[0024] Step 2, the reverse side of the PCB board 10 is placed ( image 3 Shown), on the reverse side of the PCB 10, corresponding to the front several hole positions 12 to be cut, when milling the profile, a hole is drilled at the side of the knife. The front side of the PCB board 10 has several holes to be cut 12. When milling the shape, the side of the knife is as follows: figure 2 at the position shown...
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The invention provides a method for removing a semi-metalized hole flash by back drilling, comprising the steps of: (1) providing a PCB (Printed Circuit Board) board, wherein the front surface of the PCB board has to-be-cut hole positions of a plurality of metalized holes; (2) placing the PCB board front surface down, and drilling an extra hole at the knife-out side during the shape milling on the back surface of the PCB board corresponding to the plurality of to-be-cut hole positions on the front surface; and (3) placing the PCB board back surface down, and carrying out shape milling treatment to the to-be-cut hole positions of the plurality of metalized holes on the front surface of the PCB board. The method for removing the semi-metalized hole flash by back drilling is characterized inthat: the board is firstly placed front surface down, an extra hole is drilled at the knife-out side during the shape milling by using a drilling method, and the shape milling is carried out on the front surface; the method for drilling an extra hole at the side without a support can effectively remove the semi-hole flash, improve the problem caused by the semi-hole flash, and increase the rate of good product.
Description
technical field [0001] The invention relates to a drilling method, in particular to a method for removing peaks in semi-metallized holes by back drilling. Background technique [0002] With the vigorous development of the electronics industry, electronic products continue to develop towards light, thin, short, and small, and the printed circuit board (PCB: Printed Circuit Board) is also developing towards high-density wiring interconnection (HDI: Hihg Density Interconnection) process technology. It enables the PCB to provide more functions in a smaller space. [0003] A via hole refers to a hole on a multilayer circuit board that is only used for conductive interconnection between layers, and is generally no longer used for plug-in soldering of component pins. This type of hole is plated with a layer of copper in the hole through the "copper sinking" process to conduct electricity. The via holes include "Through Via Hole" that runs through the entire board, "Blind Via Hole...
Claims
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IPC IPC(8): H05K3/00
Inventor 杨华
Owner 江西红板科技股份有限公司