Encapsulation coating to reduce particle shedding
A coating, polymer coating technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, circuits, piezoelectric/electrostrictive/magnetostrictive devices, etc. PZT components are not coated, etc.
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[0043] It is an object of embodiments of the present invention to reduce particle shedding from ceramic components by applying coatings to capture and contain particles that would otherwise be trapped in particle-sensitive environments (e.g., inside hard drive housings, in living substrates application, or any other suitable application). Examples of ceramic components include, but are not limited to, piezoelectric materials, PZT materials, or any other brittle or brittle materials that may be subject to particle shedding. The coating is applied by precise application methods, such as by using inkjet technology which applies the coating directly onto the desired exposed surfaces of the component, and only to those areas where the coating is desired. Other methods include the use of photolithographic methods, which apply the coating to the entire ceramic component and remove the coating from surfaces in the final product that do not require coating. The areas finally to be coa...
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